A. Farcy
Impact in
-
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Photonic and Optical Devices
- Hardware and Architecture top 5%
Papers in
-
- 3D IC and TSV technologies 101
- Semiconductor materials and devices 73
- Electronic Packaging and Soldering Technologies 46
- Electromagnetic Compatibility and Noise Suppression 22
- Advancements in Semiconductor Devices and Circuit Design 13
- Integrated Circuits and Semiconductor Failure Analysis 10
-
- Copper Interconnects and Reliability 60
- Co-authors
- T. Lacrevaz (44 shared papers)C. Bermond (48 shared papers)B. Fléchet (46 shared papers)J. Torrès (40 shared papers)Philip R. LeDuc (14 shared papers)Frederic Boeuf (4 shared papers)Nicolas Sillon (14 shared papers)T. Skotnicki (3 shared papers)
- Journals
- Microelectronic Engineering (26 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Electron Devices (2 papers)Journal of Nanoscience and Nanotechnology (1 paper)IEEE Design and Test (1 paper)
- Partner nations
- FranceSwitzerlandIndia
In The Last Decade
A. Farcy
148 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 1.7k
- Hardware and Architecture 154
- Electronic, Optical and Magnetic Materials 320
- Automotive Engineering 133
- Computer Networks and Communications 128
Countries citing papers authored by A. Farcy
This map shows the geographic impact of A. Farcy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Farcy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Farcy more than expected).
Fields of papers citing papers by A. Farcy
This network shows the impact of papers produced by A. Farcy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Farcy. The network helps show where A. Farcy may publish in the future.
Co-authors
The 25 scholars most cited alongside A. Farcy, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 153 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 170 | |
| 2 | 2020 | 99 | |
| 3 | 2016 | 84 | |
| 4 | 2013 | 83 | |
| 5 | 2018 | 75 | |
| 6 | 2019 | 56 | |
| 7 | 2009 | 52 | |
| 8 | 2020 | 51 | |
| 9 | 2010 | 46 | |
| 10 | 2014 | 43 | |
| 11 | 2015 | 37 | |
| 12 | 2009 | 36 | |
| 13 | 2017 | 32 | |
| 14 | 2009 | 30 | |
| 15 | 2006 | 27 | |
| 16 | 2010 | 26 | |
| 17 | 2005 | 25 | |
| 18 | 2009 | 23 | |
| 19 | 2019 | 22 | |
| 20 | 2008 | 21 |
About A. Farcy
A. Farcy is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering, Hardware and Architecture and Atomic and Molecular Physics, and Optics, having authored 153 papers that have together received 1.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (101 papers), Semiconductor materials and devices (73 papers), Copper Interconnects and Reliability (60 papers), Electronic Packaging and Soldering Technologies (46 papers), Electromagnetic Compatibility and Noise Suppression (22 papers), Additive Manufacturing and 3D Printing Technologies (16 papers), Advancements in Semiconductor Devices and Circuit Design (13 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Hardware and Architecture (154 citations), Electronic, Optical and Magnetic Materials (320 citations), Automotive Engineering (133 citations) and Computer Networks and Communications (128 citations). A. Farcy has collaborated with scholars based in France, Switzerland and India. Frequent co-authors include T. Lacrevaz, C. Bermond, B. Fléchet, J. Torrès, Philip R. LeDuc, Frederic Boeuf, Nicolas Sillon, T. Skotnicki, Severine Cheramy and P. Ancey. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electron Devices, Journal of Nanoscience and Nanotechnology and IEEE Design and Test.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.