M. Assous
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- 3D IC and TSV technologies 28
- Electronic Packaging and Soldering Technologies 20
- Semiconductor materials and devices 13
- Photonic and Optical Devices 4
- Semiconductor Lasers and Optical Devices 4
- Advancements in Semiconductor Devices and Circuit Design 4
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- Copper Interconnects and Reliability 21
- Co-authors
- A. Farcy (7 shared papers)R. Blanc (4 shared papers)S. Borel (7 shared papers)D. Louis (6 shared papers)M. Fayolle (7 shared papers)Jean Charbonnier (10 shared papers)O. Louveau (5 shared papers)N. Sillon (5 shared papers)
- Journals
- Microelectronic Engineering (9 papers)Applied Spectroscopy (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)MRS Communications (1 paper)Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena (1 paper)
- Partner nations
- FranceSwitzerlandJapan
In The Last Decade
M. Assous
43 papers receiving 433 citations
Peers
Comparison fields: 5 of 34
- Electronic, Optical and Magnetic Materials 155
- Electrical and Electronic Engineering 423
- Automotive Engineering 35
- Mechanics of Materials 62
- Hardware and Architecture 14
Countries citing papers authored by M. Assous
This map shows the geographic impact of M. Assous's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Assous with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Assous more than expected).
Fields of papers citing papers by M. Assous
This network shows the impact of papers produced by M. Assous. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Assous. The network helps show where M. Assous may publish in the future.
Co-authors
The 25 scholars most cited alongside M. Assous, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 46 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 44 | |
| 2 | 2001 | 33 | |
| 3 | 2013 | 32 | |
| 4 | 2020 | 27 | |
| 5 | 2020 | 25 | |
| 6 | 2002 | 24 | |
| 7 | 2009 | 22 | |
| 8 | 2002 | 20 | |
| 9 | 2005 | 20 | |
| 10 | 2009 | 19 | |
| 11 | 2009 | 17 | |
| 12 | 2003 | 15 | |
| 13 | 2009 | 15 | |
| 14 | 2002 | 15 | |
| 15 | 2023 | 14 | |
| 16 | 2012 | 11 | |
| 17 | 2024 | 10 | |
| 18 | 1975 | 9 | |
| 19 | 2023 | 7 | |
| 20 | 2001 | 7 |
About M. Assous
M. Assous is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Automotive Engineering, having authored 46 papers that have together received 456 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (28 papers), Copper Interconnects and Reliability (21 papers), Electronic Packaging and Soldering Technologies (20 papers), Semiconductor materials and devices (13 papers), Nanofabrication and Lithography Techniques (5 papers), Photonic and Optical Devices (4 papers), Semiconductor Lasers and Optical Devices (4 papers) and Advancements in Semiconductor Devices and Circuit Design (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (155 citations), Electrical and Electronic Engineering (423 citations), Automotive Engineering (35 citations), Mechanics of Materials (62 citations) and Hardware and Architecture (14 citations). M. Assous has collaborated with scholars based in France, Switzerland and Japan. Frequent co-authors include A. Farcy, R. Blanc, S. Borel, D. Louis, M. Fayolle, Jean Charbonnier, O. Louveau, N. Sillon, O. Joubert and H. Feldis. Their work appears in journals such as Microelectronic Engineering, Applied Spectroscopy, IEEE Transactions on Device and Materials Reliability, MRS Communications and Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.