D. Bouchu
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- 3D IC and TSV technologies 27
- Electronic Packaging and Soldering Technologies 21
- Semiconductor materials and devices 11
- Integrated Circuits and Semiconductor Failure Analysis 2
- Advancements in Photolithography Techniques 2
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- Copper Interconnects and Reliability 22
- Co-authors
- S. Moreau (15 shared papers)S. Lhostis (6 shared papers)L. Arnaud (5 shared papers)A. Farcy (5 shared papers)H. Frémont (3 shared papers)M. Assous (6 shared papers)N. Sillon (4 shared papers)G. Passemard (5 shared papers)
- Journals
- Microelectronic Engineering (3 papers)IEEE Electron Device Letters (2 papers)ECS Journal of Solid State Science and Technology (2 papers)Microelectronics Reliability (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- FranceSwitzerlandBelgium
In The Last Decade
D. Bouchu
34 papers receiving 302 citations
Peers
Comparison fields: 5 of 27
- Electronic, Optical and Magnetic Materials 113
- Electrical and Electronic Engineering 292
- Automotive Engineering 29
- Hardware and Architecture 13
- Surfaces, Coatings and Films 7
Countries citing papers authored by D. Bouchu
This map shows the geographic impact of D. Bouchu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Bouchu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Bouchu more than expected).
Fields of papers citing papers by D. Bouchu
This network shows the impact of papers produced by D. Bouchu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Bouchu. The network helps show where D. Bouchu may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Bouchu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 44 | |
| 2 | 2022 | 38 | |
| 3 | 2005 | 25 | |
| 4 | 2009 | 22 | |
| 5 | 2009 | 17 | |
| 6 | 2013 | 15 | |
| 7 | 2006 | 14 | |
| 8 | 2016 | 12 | |
| 9 | 2008 | 11 | |
| 10 | 2015 | 11 | |
| 11 | 2018 | 11 | |
| 12 | 2019 | 10 | |
| 13 | 2005 | 10 | |
| 14 | 2017 | 9 | |
| 15 | 2007 | 9 | |
| 16 | 2018 | 8 | |
| 17 | 2021 | 7 | |
| 18 | 2014 | 7 | |
| 19 | 2013 | 6 | |
| 20 | 2015 | 5 |
About D. Bouchu
D. Bouchu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Automotive Engineering and Biomedical Engineering, having authored 35 papers that have together received 320 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (27 papers), Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (21 papers), Semiconductor materials and devices (11 papers), Semiconductor materials and interfaces (3 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Additive Manufacturing and 3D Printing Technologies (2 papers) and Advancements in Photolithography Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (113 citations), Electrical and Electronic Engineering (292 citations), Automotive Engineering (29 citations), Hardware and Architecture (13 citations) and Surfaces, Coatings and Films (7 citations). D. Bouchu has collaborated with scholars based in France, Switzerland and Belgium. Frequent co-authors include S. Moreau, S. Lhostis, L. Arnaud, A. Farcy, H. Frémont, M. Assous, N. Sillon, G. Passemard, L. Di Cioccio and L.G. Gosset. Their work appears in journals such as Microelectronic Engineering, IEEE Electron Device Letters, ECS Journal of Solid State Science and Technology, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.