D. Bouchu
Impact in
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- 3D IC and TSV technologies
- Advancements in Semiconductor Devices and Circuit Design
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced Memory and Neural Computing
- Advanced MEMS and NEMS Technologies
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 18
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- 3D IC and TSV technologies 23
- Integrated Circuits and Semiconductor Failure Analysis 3
- Electronic Packaging and Soldering Technologies 1
- Advancements in Semiconductor Devices and Circuit Design 1
- Advanced MEMS and NEMS Technologies 1
- Co-authors
- Stephane Moreau (16 shared papers)S. Lhostis (6 shared papers)H. Frémont (3 shared papers)A. Farcy (5 shared papers)L. Arnaud (5 shared papers)Myriam Assous (6 shared papers)L. Di Cioccio (6 shared papers)G. Passemard (5 shared papers)
In The Last Decade
D. Bouchu
38 papers receiving 445 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 389
- Electronic, Optical and Magnetic Materials 102
- Hardware and Architecture 13
- Electrochemistry 2
- Materials Chemistry 23
Countries citing papers authored by D. Bouchu
This map shows the geographic impact of D. Bouchu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Bouchu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Bouchu more than expected).
Fields of papers citing papers by D. Bouchu
This network shows the impact of papers produced by D. Bouchu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Bouchu. The network helps show where D. Bouchu may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Bouchu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 78 | |
| 2 | 2010 | 45 | |
| 3 | 2022 | 45 | |
| 4 | 2008 | 39 | |
| 5 | 2005 | 25 | |
| 6 | 2009 | 23 | |
| 7 | 2009 | 17 | |
| 8 | 2006 | 15 | |
| 9 | 2013 | 15 | |
| 10 | 2015 | 14 | |
| 11 | 2016 | 14 | |
| 12 | 2018 | 13 | |
| 13 | 2008 | 11 | |
| 14 | 2017 | 11 | |
| 15 | 2005 | 10 | |
| 16 | 2019 | 10 | |
| 17 | 2007 | 9 | |
| 18 | 2018 | 8 | |
| 19 | 2021 | 8 | |
| 20 | 2008 | 7 |
About D. Bouchu
D. Bouchu is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Hardware and Architecture, Mechanics of Materials and Nuclear Energy and Engineering, having authored 39 papers that have together received 475 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (23 papers), Copper Interconnects and Reliability (18 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), VLSI and Analog Circuit Testing (1 paper), Electronic Packaging and Soldering Technologies (1 paper), Advancements in Semiconductor Devices and Circuit Design (1 paper), Ultrasonics and Acoustic Wave Propagation (1 paper) and Advanced MEMS and NEMS Technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (389 citations), Electronic, Optical and Magnetic Materials (102 citations), Hardware and Architecture (13 citations), Electrochemistry (2 citations) and Materials Chemistry (23 citations). D. Bouchu has collaborated with scholars based in France, Belgium and Germany. Frequent co-authors include Stephane Moreau, S. Lhostis, H. Frémont, A. Farcy, L. Arnaud, Myriam Assous, L. Di Cioccio, G. Passemard, Nicolas Sillon and L.G. Gosset. Their work appears in journals such as Microelectronic Engineering, ECS Journal of Solid State Science and Technology, IEEE Electron Device Letters, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.