A. Jouve
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Photolithography Techniques
Papers in
-
- 3D IC and TSV technologies 29
- Electronic Packaging and Soldering Technologies 19
- Semiconductor materials and devices 6
- Advancements in Photolithography Techniques 5
- Integrated Circuits and Semiconductor Failure Analysis 3
-
- Additive Manufacturing and 3D Printing Technologies 8
- Co-authors
- S. Chéramy (20 shared papers)N. Sillon (6 shared papers)Frank Fournel (10 shared papers)David Henry (3 shared papers)J.J. Brun (2 shared papers)V. Balan (7 shared papers)S. Lhostis (8 shared papers)N. Bresson (7 shared papers)
- Journals
- Proceedings - International Symposium for Testing and Failure Analysis (1 paper)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)HAL (Le Centre pour la Communication Scientifique Directe) (9 papers)
- Partner nations
- FranceUnited StatesAustria
In The Last Decade
A. Jouve
29 papers receiving 286 citations
Peers
Comparison fields: 5 of 23
- Automotive Engineering 84
- Electrical and Electronic Engineering 312
- Electronic, Optical and Magnetic Materials 45
- Biomedical Engineering 70
- Hardware and Architecture 8
Countries citing papers authored by A. Jouve
This map shows the geographic impact of A. Jouve's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Jouve with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Jouve more than expected).
Fields of papers citing papers by A. Jouve
This network shows the impact of papers produced by A. Jouve. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Jouve. The network helps show where A. Jouve may publish in the future.
Co-authors
The 25 scholars most cited alongside A. Jouve, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 52 | |
| 2 | 2008 | 37 | |
| 3 | 2017 | 31 | |
| 4 | 2013 | 18 | |
| 5 | 2015 | 16 | |
| 6 | 2018 | 16 | |
| 7 | 2005 | 14 | |
| 8 | 2020 | 14 | |
| 9 | 2016 | 12 | |
| 10 | 2012 | 11 | |
| 11 | 2012 | 11 | |
| 12 | 2011 | 9 | |
| 13 | 2019 | 9 | |
| 14 | 2018 | 8 | |
| 15 | 2014 | 8 | |
| 16 | 2013 | 8 | |
| 17 | 2019 | 8 | |
| 18 | 2019 | 7 | |
| 19 | 2016 | 6 | |
| 20 | 2016 | 5 |
About A. Jouve
A. Jouve is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Hardware and Architecture, having authored 30 papers that have together received 317 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (19 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Copper Interconnects and Reliability (7 papers), Semiconductor materials and devices (6 papers), Advancements in Photolithography Techniques (5 papers), Advanced Surface Polishing Techniques (5 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). The work is most often cited by research in Automotive Engineering (84 citations), Electrical and Electronic Engineering (312 citations), Electronic, Optical and Magnetic Materials (45 citations), Biomedical Engineering (70 citations) and Hardware and Architecture (8 citations). A. Jouve has collaborated with scholars based in France, United States and Austria. Frequent co-authors include S. Chéramy, N. Sillon, Frank Fournel, David Henry, J.J. Brun, V. Balan, S. Lhostis, N. Bresson, A. Farcy and Marc Zussy. Their work appears in journals such as Proceedings - International Symposium for Testing and Failure Analysis, Additional Conferences (Device Packaging HiTEC HiTEN & CICMT), Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE and HAL (Le Centre pour la Communication Scientifique Directe).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.