Patrick Leduc
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Photolithography Techniques
Papers in
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- 3D IC and TSV technologies 13
- Electronic Packaging and Soldering Technologies 10
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- Copper Interconnects and Reliability 6
- Co-authors
- L. Di Cioccio (8 shared papers)N. Sillon (8 shared papers)Laurent Blanchoin (1 shared paper)Manuel Théry (1 shared paper)Rémi Galland (1 shared paper)Christophe Guérin (1 shared paper)David Peyrade (1 shared paper)S. Maı̂trejean (4 shared papers)
- Journals
- Microelectronic Engineering (2 papers)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Proceedings of the IEEE (1 paper)Nature Materials (1 paper)ECS Transactions (1 paper)
- Partner nations
- FranceSwitzerlandUnited States
In The Last Decade
Patrick Leduc
20 papers receiving 260 citations
Peers
Comparison fields: 5 of 43
- Automotive Engineering 59
- Electrical and Electronic Engineering 208
- Hardware and Architecture 16
- Electronic, Optical and Magnetic Materials 32
- Biomedical Engineering 54
Countries citing papers authored by Patrick Leduc
This map shows the geographic impact of Patrick Leduc's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Leduc with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Leduc more than expected).
Fields of papers citing papers by Patrick Leduc
This network shows the impact of papers produced by Patrick Leduc. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Leduc. The network helps show where Patrick Leduc may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick Leduc, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 69 | |
| 2 | 2013 | 51 | |
| 3 | 2009 | 37 | |
| 4 | 2009 | 22 | |
| 5 | 2009 | 20 | |
| 6 | 2009 | 16 | |
| 7 | 2006 | 14 | |
| 8 | 2010 | 9 | |
| 9 | 2008 | 7 | |
| 10 | 2009 | 6 | |
| 11 | 2012 | 4 | |
| 12 | 2010 | 3 | |
| 13 | 2023 | 2 | |
| 14 | 2008 | 2 | |
| 15 | 2010 | 2 | |
| 16 | 2013 | 1 | |
| 17 | 2007 | 1 | |
| 18 | 2009 | 1 | |
| 19 | 2006 | 1 | |
| 20 | 2021 | 1 |
About Patrick Leduc
Patrick Leduc is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Automotive Engineering and Mechanics of Materials, having authored 21 papers that have together received 269 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (10 papers), Copper Interconnects and Reliability (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Advanced Surface Polishing Techniques (4 papers), Metal and Thin Film Mechanics (2 papers), Particle Detector Development and Performance (1 paper) and Advanced Statistical Process Monitoring (1 paper). The work is most often cited by research in Automotive Engineering (59 citations), Electrical and Electronic Engineering (208 citations), Hardware and Architecture (16 citations), Electronic, Optical and Magnetic Materials (32 citations) and Biomedical Engineering (54 citations). Patrick Leduc has collaborated with scholars based in France, Switzerland and United States. Frequent co-authors include L. Di Cioccio, N. Sillon, Laurent Blanchoin, Manuel Théry, Rémi Galland, Christophe Guérin, David Peyrade, S. Maı̂trejean, G. Passemard and Barbara Charlet. Their work appears in journals such as Microelectronic Engineering, Journal of materials research/Pratt's guide to venture capital sources, Proceedings of the IEEE, Nature Materials and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.