Patrick Leduc
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced Memory and Neural Computing
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- VLSI and Analog Circuit Testing
Papers in
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- 3D IC and TSV technologies 20
- Advanced Measurement and Detection Methods 1
- Advanced Semiconductor Detectors and Materials 1
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- Copper Interconnects and Reliability 2
- Co-authors
- Nicolas Sillon (8 shared papers)L. Di Cioccio (7 shared papers)A. Farcy (6 shared papers)Marc Zussy (4 shared papers)Aurélie Thuaire (4 shared papers)Laurent Blanchoin (1 shared paper)D. Peyrade (1 shared paper)Manuel Théry (1 shared paper)
- Journals
- Microelectronic Engineering (2 papers)Nature Materials (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Proceedings of the IEEE (1 paper)ECS Transactions (1 paper)
- Partner nations
- FranceUnited StatesBelgium
In The Last Decade
Patrick Leduc
24 papers receiving 511 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 421
- Hardware and Architecture 30
- Automotive Engineering 19
- Electronic, Optical and Magnetic Materials 30
- Instrumentation 4
Countries citing papers authored by Patrick Leduc
This map shows the geographic impact of Patrick Leduc's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Leduc with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Leduc more than expected).
Fields of papers citing papers by Patrick Leduc
This network shows the impact of papers produced by Patrick Leduc. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Leduc. The network helps show where Patrick Leduc may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick Leduc, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 25 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 83 | |
| 2 | 2013 | 55 | |
| 3 | 2018 | 43 | |
| 4 | 2009 | 41 | |
| 5 | 2008 | 39 | |
| 6 | 2007 | 37 | |
| 7 | 2009 | 36 | |
| 8 | 2012 | 34 | |
| 9 | 2010 | 33 | |
| 10 | 2009 | 26 | |
| 11 | 2009 | 23 | |
| 12 | Through-silicon via based 3D IC technology: Electrostatic simulations for design methodology | 2008 | 20 |
| 13 | 2009 | 17 | |
| 14 | 2006 | 14 | |
| 15 | Impact of substrate coupling induced by 3D-IC architecture on advanced CMOS technology | 2009 | 12 |
| 16 | 2010 | 10 | |
| 17 | 2009 | 8 | |
| 18 | 2008 | 7 | |
| 19 | 2010 | 4 | |
| 20 | 2012 | 4 |
About Patrick Leduc
Patrick Leduc is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Automotive Engineering and Nuclear Energy and Engineering, having authored 25 papers that have together received 553 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), Advanced Surface Polishing Techniques (3 papers), Copper Interconnects and Reliability (2 papers), Autonomous Vehicle Technology and Safety (1 paper), Advanced Measurement and Detection Methods (1 paper) and Advanced Semiconductor Detectors and Materials (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (421 citations), Hardware and Architecture (30 citations), Automotive Engineering (19 citations), Electronic, Optical and Magnetic Materials (30 citations) and Instrumentation (4 citations). Patrick Leduc has collaborated with scholars based in France, United States and Belgium. Frequent co-authors include Nicolas Sillon, L. Di Cioccio, A. Farcy, Marc Zussy, Aurélie Thuaire, Laurent Blanchoin, D. Peyrade, Manuel Théry, Rémi Galland and Lorena Anghel. Their work appears in journals such as Microelectronic Engineering, Nature Materials, Journal of materials research/Pratt's guide to venture capital sources, Proceedings of the IEEE and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.