S. Chéramy
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
Papers in
-
- 3D IC and TSV technologies 50
- Electronic Packaging and Soldering Technologies 36
- Semiconductor materials and devices 12
- Advancements in Semiconductor Devices and Circuit Design 4
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- Additive Manufacturing and 3D Printing Technologies 13
- Co-authors
- A. Jouve (20 shared papers)A. Farcy (17 shared papers)N. Sillon (14 shared papers)Jean Charbonnier (8 shared papers)David Henry (7 shared papers)Frank Fournel (9 shared papers)Pascal Vivet (10 shared papers)N. Bresson (7 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Nuclear Science (2 papers)Microelectronic Engineering (1 paper)IEEE Electron Device Letters (1 paper)IEEE Journal of Solid-State Circuits (1 paper)
- Partner nations
- FranceSwitzerlandUnited States
In The Last Decade
S. Chéramy
61 papers receiving 501 citations
Peers
Comparison fields: 5 of 36
- Automotive Engineering 104
- Electrical and Electronic Engineering 490
- Hardware and Architecture 40
- Electronic, Optical and Magnetic Materials 41
- Computer Networks and Communications 42
Countries citing papers authored by S. Chéramy
This map shows the geographic impact of S. Chéramy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Chéramy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Chéramy more than expected).
Fields of papers citing papers by S. Chéramy
This network shows the impact of papers produced by S. Chéramy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Chéramy. The network helps show where S. Chéramy may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Chéramy, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 61 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 48 | |
| 2 | A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC | 2013 | 33 |
| 3 | 2017 | 27 | |
| 4 | 2010 | 26 | |
| 5 | 2016 | 25 | |
| 6 | 2020 | 24 | |
| 7 | 2016 | 19 | |
| 8 | 2019 | 17 | |
| 9 | 2021 | 15 | |
| 10 | 2009 | 15 | |
| 11 | 2013 | 14 | |
| 12 | 2020 | 14 | |
| 13 | 2015 | 14 | |
| 14 | 2011 | 14 | |
| 15 | 2009 | 13 | |
| 16 | 2012 | 11 | |
| 17 | 2012 | 11 | |
| 18 | 3D integration process flow for set-top box application: Description of technology and electrical results | 2009 | 10 |
| 19 | 2019 | 9 | |
| 20 | 2021 | 8 |
About S. Chéramy
S. Chéramy is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Mechanical Engineering, having authored 61 papers that have together received 522 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (50 papers), Electronic Packaging and Soldering Technologies (36 papers), Additive Manufacturing and 3D Printing Technologies (13 papers), Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (10 papers), Advanced Surface Polishing Techniques (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers) and Heat Transfer and Optimization (4 papers). The work is most often cited by research in Automotive Engineering (104 citations), Electrical and Electronic Engineering (490 citations), Hardware and Architecture (40 citations), Electronic, Optical and Magnetic Materials (41 citations) and Computer Networks and Communications (42 citations). S. Chéramy has collaborated with scholars based in France, Switzerland and United States. Frequent co-authors include A. Jouve, A. Farcy, N. Sillon, Jean Charbonnier, David Henry, Frank Fournel, Pascal Vivet, N. Bresson, Didier Lattard and J. Michailos. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Nuclear Science, Microelectronic Engineering, IEEE Electron Device Letters and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.