L.W. Schaper
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Electrodeposition and Electroless Coatings
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 32
- Semiconductor materials and devices 24
- Electronic Packaging and Soldering Technologies 23
- Electromagnetic Compatibility and Noise Suppression 7
- Low-power high-performance VLSI design 5
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Copper Interconnects and Reliability 15
- Co-authors
- S. L. Burkett (19 shared papers)Zia Ur Rahman (3 shared papers)Simon S. Ang (14 shared papers)W.D. Brown (14 shared papers)Hameed A. Naseem (7 shared papers)Li Cai (7 shared papers)Y.L. Low (4 shared papers)Ajay P. Malshe (3 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)Thin Solid Films (2 papers)Journal of Applied Physics (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (2 papers)
- Partner nations
- United StatesUnited Kingdom
In The Last Decade
L.W. Schaper
60 papers receiving 635 citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 563
- Electronic, Optical and Magnetic Materials 108
- Automotive Engineering 43
- Hardware and Architecture 23
- Biomedical Engineering 117
Countries citing papers authored by L.W. Schaper
This map shows the geographic impact of L.W. Schaper's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.W. Schaper with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.W. Schaper more than expected).
Fields of papers citing papers by L.W. Schaper
This network shows the impact of papers produced by L.W. Schaper. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.W. Schaper. The network helps show where L.W. Schaper may publish in the future.
Co-authors
The 25 scholars most cited alongside L.W. Schaper, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 64 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 55 | |
| 2 | 2005 | 51 | |
| 3 | 1995 | 38 | |
| 4 | 2009 | 38 | |
| 5 | 2005 | 36 | |
| 6 | 2004 | 35 | |
| 7 | 1992 | 25 | |
| 8 | 2004 | 25 | |
| 9 | 2007 | 25 | |
| 10 | 2008 | 24 | |
| 11 | 2006 | 24 | |
| 12 | 1999 | 20 | |
| 13 | 1995 | 17 | |
| 14 | 2006 | 16 | |
| 15 | 2002 | 16 | |
| 16 | 2000 | 14 | |
| 17 | 1995 | 13 | |
| 18 | 1996 | 12 | |
| 19 | 1984 | 11 | |
| 20 | 1995 | 11 |
About L.W. Schaper
L.W. Schaper is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Materials Chemistry and Hardware and Architecture, having authored 64 papers that have together received 669 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (32 papers), Semiconductor materials and devices (24 papers), Electronic Packaging and Soldering Technologies (23 papers), Copper Interconnects and Reliability (15 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Low-power high-performance VLSI design (5 papers), Physics of Superconductivity and Magnetism (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (563 citations), Electronic, Optical and Magnetic Materials (108 citations), Automotive Engineering (43 citations), Hardware and Architecture (23 citations) and Biomedical Engineering (117 citations). L.W. Schaper has collaborated with scholars based in United States and United Kingdom. Frequent co-authors include S. L. Burkett, Zia Ur Rahman, Simon S. Ang, W.D. Brown, Hameed A. Naseem, Li Cai, Y.L. Low, Ajay P. Malshe, J.P. Parkerson and Timothy T.-Y. Lam. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Thin Solid Films, Journal of Applied Physics, IEEE Transactions on Components and Packaging Technologies and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.