C. Bermond
Impact in
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Ferroelectric and Negative Capacitance Devices
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
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- Copper Interconnects and Reliability
Papers in
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- Semiconductor materials and devices 21
- 3D IC and TSV technologies 19
- Electromagnetic Compatibility and Noise Suppression 12
- Electronic Packaging and Soldering Technologies 6
- Low-power high-performance VLSI design 5
- Microwave and Dielectric Measurement Techniques 4
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- Copper Interconnects and Reliability 21
- Co-authors
- B. Fléchet (34 shared papers)T. Lacrevaz (24 shared papers)A. Farcy (30 shared papers)M. Gros‐Jean (5 shared papers)T. Bertaud (5 shared papers)S. Blonkowski (2 shared papers)C. Vallée (2 shared papers)J. Torrès (18 shared papers)
- Journals
- Microelectronic Engineering (12 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing (1 paper)IEEE Electron Device Letters (1 paper)Electronics Letters (1 paper)
- Partner nations
- FranceSwitzerlandUnited States
In The Last Decade
C. Bermond
42 papers receiving 223 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 199
- Electronic, Optical and Magnetic Materials 56
- Materials Chemistry 62
- Acoustics and Ultrasonics 1
- Biomedical Engineering 36
Countries citing papers authored by C. Bermond
This map shows the geographic impact of C. Bermond's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Bermond with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Bermond more than expected).
Fields of papers citing papers by C. Bermond
This network shows the impact of papers produced by C. Bermond. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Bermond. The network helps show where C. Bermond may publish in the future.
Co-authors
The 25 scholars most cited alongside C. Bermond, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 45 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 29 | |
| 2 | 2009 | 19 | |
| 3 | 2009 | 19 | |
| 4 | 2014 | 17 | |
| 5 | 2009 | 17 | |
| 6 | 2006 | 11 | |
| 7 | 2002 | 11 | |
| 8 | 2005 | 9 | |
| 9 | 2005 | 7 | |
| 10 | 2020 | 7 | |
| 11 | 2012 | 7 | |
| 12 | 2011 | 6 | |
| 13 | 2007 | 6 | |
| 14 | 2008 | 5 | |
| 15 | 2017 | 5 | |
| 16 | 2021 | 5 | |
| 17 | 2011 | 5 | |
| 18 | 2020 | 5 | |
| 19 | 2014 | 5 | |
| 20 | 2007 | 4 |
About C. Bermond
C. Bermond is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Biomedical Engineering and Atomic and Molecular Physics, and Optics, having authored 45 papers that have together received 232 indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (21 papers), 3D IC and TSV technologies (19 papers), Electromagnetic Compatibility and Noise Suppression (12 papers), Electronic Packaging and Soldering Technologies (6 papers), Ferroelectric and Piezoelectric Materials (5 papers), Low-power high-performance VLSI design (5 papers) and Microwave and Dielectric Measurement Techniques (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (199 citations), Electronic, Optical and Magnetic Materials (56 citations), Materials Chemistry (62 citations), Acoustics and Ultrasonics (1 citation) and Biomedical Engineering (36 citations). C. Bermond has collaborated with scholars based in France, Switzerland and United States. Frequent co-authors include B. Fléchet, T. Lacrevaz, A. Farcy, M. Gros‐Jean, T. Bertaud, S. Blonkowski, C. Vallée, J. Torrès, Emmanuel Defaÿ and Trinh Vo. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing, IEEE Electron Device Letters and Electronics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.