L. Arnaud
Impact in
-
- Copper Interconnects and Reliability
-
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Semiconductor materials and devices 49
- Electronic Packaging and Soldering Technologies 46
- 3D IC and TSV technologies 24
-
- Copper Interconnects and Reliability 68
- Co-authors
- G. Reimbold (12 shared papers)S. Moreau (9 shared papers)Y. Wouters (18 shared papers)Thomas Frank (4 shared papers)Lorena Anghel (4 shared papers)C. Chappaz (4 shared papers)F. Lorut (2 shared papers)Aurélie Thuaire (2 shared papers)
- Journals
- Microelectronic Engineering (12 papers)Microelectronics Reliability (9 papers)IEEE Transactions on Magnetics (7 papers)Journal of Applied Physics (3 papers)BioMetals (1 paper)
- Partner nations
- FranceSwitzerlandBelgium
In The Last Decade
L. Arnaud
84 papers receiving 803 citations
Peers
Comparison fields: 5 of 61
- Electronic, Optical and Magnetic Materials 422
- Electrical and Electronic Engineering 699
- Atomic and Molecular Physics, and Optics 120
- Mechanics of Materials 91
- Automotive Engineering 44
Countries citing papers authored by L. Arnaud
This map shows the geographic impact of L. Arnaud's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Arnaud with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Arnaud more than expected).
Fields of papers citing papers by L. Arnaud
This network shows the impact of papers produced by L. Arnaud. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Arnaud. The network helps show where L. Arnaud may publish in the future.
Co-authors
The 25 scholars most cited alongside L. Arnaud, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 88 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 98 | |
| 2 | 2011 | 65 | |
| 3 | 2002 | 62 | |
| 4 | 2008 | 54 | |
| 5 | 2022 | 38 | |
| 6 | 2017 | 31 | |
| 7 | 1988 | 25 | |
| 8 | 2020 | 25 | |
| 9 | 2002 | 24 | |
| 10 | 1998 | 23 | |
| 11 | 2018 | 23 | |
| 12 | 2016 | 20 | |
| 13 | 2002 | 20 | |
| 14 | 2009 | 19 | |
| 15 | 1988 | 18 | |
| 16 | 2004 | 18 | |
| 17 | 2019 | 17 | |
| 18 | 2018 | 16 | |
| 19 | 2004 | 9 | |
| 20 | 2003 | 9 |
About L. Arnaud
L. Arnaud is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Materials Chemistry and Mechanics of Materials, having authored 88 papers that have together received 835 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (68 papers), Semiconductor materials and devices (49 papers), Electronic Packaging and Soldering Technologies (46 papers), 3D IC and TSV technologies (24 papers), Semiconductor materials and interfaces (6 papers), Phase-change materials and chalcogenides (6 papers), Metal and Thin Film Mechanics (5 papers) and Magnetic properties of thin films (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (422 citations), Electrical and Electronic Engineering (699 citations), Atomic and Molecular Physics, and Optics (120 citations), Mechanics of Materials (91 citations) and Automotive Engineering (44 citations). L. Arnaud has collaborated with scholars based in France, Switzerland and Belgium. Frequent co-authors include G. Reimbold, S. Moreau, Y. Wouters, Thomas Frank, Lorena Anghel, C. Chappaz, F. Lorut, Aurélie Thuaire, Philip R. LeDuc and Laurent Doyen. Their work appears in journals such as Microelectronic Engineering, Microelectronics Reliability, IEEE Transactions on Magnetics, Journal of Applied Physics and BioMetals.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.