L.L. Chapelon
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
Papers in
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- Semiconductor materials and devices 13
- 3D IC and TSV technologies 12
- Electronic Packaging and Soldering Technologies 7
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- Copper Interconnects and Reliability 17
- Co-authors
- J. Torrès (9 shared papers)Pierric Gueguen (4 shared papers)L. Clavelier (4 shared papers)R. Taïbi (5 shared papers)L. Di Cioccio (5 shared papers)F. de Crécy (4 shared papers)V. Arnal (7 shared papers)C. Chappaz (3 shared papers)
- Journals
- Microelectronic Engineering (9 papers)Journal of The Electrochemical Society (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)Photoacoustics (1 paper)ECS Transactions (1 paper)
- Partner nations
- FranceSwitzerlandIndia
In The Last Decade
L.L. Chapelon
23 papers receiving 289 citations
Peers
Comparison fields: 5 of 24
- Electronic, Optical and Magnetic Materials 129
- Electrical and Electronic Engineering 260
- Ceramics and Composites 16
- Automotive Engineering 32
- Mechanics of Materials 65
Countries citing papers authored by L.L. Chapelon
This map shows the geographic impact of L.L. Chapelon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.L. Chapelon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.L. Chapelon more than expected).
Fields of papers citing papers by L.L. Chapelon
This network shows the impact of papers produced by L.L. Chapelon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.L. Chapelon. The network helps show where L.L. Chapelon may publish in the future.
Co-authors
The 25 scholars most cited alongside L.L. Chapelon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 25 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 70 | |
| 2 | 2010 | 33 | |
| 3 | 2004 | 30 | |
| 4 | 2009 | 23 | |
| 5 | 2006 | 18 | |
| 6 | 2009 | 17 | |
| 7 | 2007 | 16 | |
| 8 | 2007 | 15 | |
| 9 | 2006 | 14 | |
| 10 | 2008 | 12 | |
| 11 | 2010 | 10 | |
| 12 | 2006 | 10 | |
| 13 | 2006 | 6 | |
| 14 | 2005 | 5 | |
| 15 | 2005 | 5 | |
| 16 | 2024 | 2 | |
| 17 | 2011 | 2 | |
| 18 | 2005 | 2 | |
| 19 | 2005 | 2 | |
| 20 | 2006 | 1 |
About L.L. Chapelon
L.L. Chapelon is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Automotive Engineering, having authored 25 papers that have together received 296 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (17 papers), Semiconductor materials and devices (13 papers), 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (7 papers), Advanced Surface Polishing Techniques (4 papers), Metal and Thin Film Mechanics (4 papers), Semiconductor materials and interfaces (2 papers) and Nanofabrication and Lithography Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (129 citations), Electrical and Electronic Engineering (260 citations), Ceramics and Composites (16 citations), Automotive Engineering (32 citations) and Mechanics of Materials (65 citations). L.L. Chapelon has collaborated with scholars based in France, Switzerland and India. Frequent co-authors include J. Torrès, Pierric Gueguen, L. Clavelier, R. Taïbi, L. Di Cioccio, F. de Crécy, V. Arnal, C. Chappaz, Didier Landru and F. Rieutord. Their work appears in journals such as Microelectronic Engineering, Journal of The Electrochemical Society, IEEE Transactions on Semiconductor Manufacturing, Photoacoustics and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.