J. Maiz
Impact in
- Hardware and Architecture top 1%
- VLSI and Analog Circuit Testing
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- Radiation Effects in Electronics
- Semiconductor materials and devices
- Low-power high-performance VLSI design
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
Papers in
-
- Semiconductor materials and devices 21
- Radiation Effects in Electronics 9
- Electronic Packaging and Soldering Technologies 9
- Integrated Circuits and Semiconductor Failure Analysis 7
- Advancements in Semiconductor Devices and Circuit Design 6
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- Copper Interconnects and Reliability 14
- Co-authors
- S.A. Hareland (5 shared papers)Peter R. Armstrong (3 shared papers)Kedong Zhang (2 shared papers)E. Andideh (1 shared paper)Valery M. Dubin (1 shared paper)John J. Plombon (1 shared paper)B. Bloechel (4 shared papers)P. Hazucha (4 shared papers)
- Journals
- Applied Physics Letters (4 papers)IEEE Transactions on Device and Materials Reliability (2 papers)IEEE Journal of Solid-State Circuits (1 paper)The Journal of the Acoustical Society of America (1 paper)Engineering Failure Analysis (1 paper)
- Partner nations
- United StatesSpainSwitzerland
In The Last Decade
J. Maiz
30 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 54
- Hardware and Architecture 457
- Electrical and Electronic Engineering 1.2k
- Electronic, Optical and Magnetic Materials 326
- Mechanics of Materials 179
- Safety, Risk, Reliability and Quality 49
Countries citing papers authored by J. Maiz
This map shows the geographic impact of J. Maiz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Maiz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Maiz more than expected).
Fields of papers citing papers by J. Maiz
This network shows the impact of papers produced by J. Maiz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Maiz. The network helps show where J. Maiz may publish in the future.
Co-authors
The 25 scholars most cited alongside J. Maiz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 32 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 188 | |
| 2 | 2006 | 158 | |
| 3 | 2006 | 129 | |
| 4 | 2004 | 118 | |
| 5 | 1999 | 105 | |
| 6 | 2004 | 93 | |
| 7 | 2002 | 92 | |
| 8 | 2006 | 81 | |
| 9 | 2008 | 62 | |
| 10 | 2005 | 60 | |
| 11 | 2004 | 56 | |
| 12 | 1991 | 35 | |
| 13 | 2006 | 35 | |
| 14 | 2003 | 34 | |
| 15 | 2004 | 28 | |
| 16 | 1987 | 14 | |
| 17 | 2004 | 14 | |
| 18 | 1989 | 13 | |
| 19 | 1999 | 12 | |
| 20 | 2006 | 11 |
About J. Maiz
J. Maiz is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Biomedical Engineering, having authored 32 papers that have together received 1.4k indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (14 papers), Radiation Effects in Electronics (9 papers), Electronic Packaging and Soldering Technologies (9 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Advancements in Semiconductor Devices and Circuit Design (6 papers), Metal and Thin Film Mechanics (5 papers) and Semiconductor materials and interfaces (4 papers). The work is most often cited by research in Hardware and Architecture (457 citations), Electrical and Electronic Engineering (1.2k citations), Electronic, Optical and Magnetic Materials (326 citations), Mechanics of Materials (179 citations) and Safety, Risk, Reliability and Quality (49 citations). J. Maiz has collaborated with scholars based in United States, Spain and Switzerland. Frequent co-authors include S.A. Hareland, Peter R. Armstrong, Kedong Zhang, E. Andideh, Valery M. Dubin, John J. Plombon, B. Bloechel, P. Hazucha, G. Dermer and Shekhar Borkar. Their work appears in journals such as Applied Physics Letters, IEEE Transactions on Device and Materials Reliability, IEEE Journal of Solid-State Circuits, The Journal of the Acoustical Society of America and Engineering Failure Analysis.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.