V. Balan
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Photonic and Optical Devices
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 10
- Electronic Packaging and Soldering Technologies 7
- Semiconductor materials and devices 5
- Photonic and Optical Devices 3
- Ferroelectric and Negative Capacitance Devices 2
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- Advanced Surface Polishing Techniques 6
- Co-authors
- A. Jouve (7 shared papers)S. Lhostis (5 shared papers)Frank Fournel (8 shared papers)N. Bresson (4 shared papers)A. Pradel (2 shared papers)Caroline Vigreux (3 shared papers)Tao Pan (1 shared paper)Andreu Llobera (1 shared paper)
- Journals
- Microelectronic Engineering (1 paper)Journal of Non-Crystalline Solids (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (2 papers)HAL (Le Centre pour la Communication Scientifique Directe) (7 papers)
- Partner nations
- FranceAustriaNetherlands
In The Last Decade
V. Balan
18 papers receiving 154 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 146
- Electronic, Optical and Magnetic Materials 35
- Automotive Engineering 22
- Ceramics and Composites 10
- Biomedical Engineering 37
Countries citing papers authored by V. Balan
This map shows the geographic impact of V. Balan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Balan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Balan more than expected).
Fields of papers citing papers by V. Balan
This network shows the impact of papers produced by V. Balan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Balan. The network helps show where V. Balan may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Balan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 30 | |
| 2 | 2003 | 20 | |
| 3 | 2015 | 16 | |
| 4 | 2018 | 16 | |
| 5 | 2016 | 12 | |
| 6 | 2020 | 11 | |
| 7 | 2019 | 9 | |
| 8 | 2003 | 8 | |
| 9 | 2017 | 8 | |
| 10 | 2015 | 7 | |
| 11 | 2024 | 4 | |
| 12 | 2004 | 4 | |
| 13 | 2024 | 4 | |
| 14 | CMP Process Optimization for Bonding Applications | 2012 | 4 |
| 15 | 2009 | 3 | |
| 16 | 2022 | 3 | |
| 17 | 2019 | 2 | |
| 18 | 2023 | 1 | |
| 19 | 2003 | 0 | |
| 20 | CMP Evaluation of Reusable Polishing Pad using Auxiliary Plate | 2012 | 0 |
About V. Balan
V. Balan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 20 papers that have together received 162 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers), Advanced Surface Polishing Techniques (6 papers), Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (4 papers), Photonic and Optical Devices (3 papers), Advanced machining processes and optimization (3 papers) and Ferroelectric and Negative Capacitance Devices (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (146 citations), Electronic, Optical and Magnetic Materials (35 citations), Automotive Engineering (22 citations), Ceramics and Composites (10 citations) and Biomedical Engineering (37 citations). V. Balan has collaborated with scholars based in France, Austria and Netherlands. Frequent co-authors include A. Jouve, S. Lhostis, Frank Fournel, N. Bresson, A. Pradel, Caroline Vigreux, Tao Pan, Andreu Llobera, M. Garriga and A. Farcy. Their work appears in journals such as Microelectronic Engineering, Journal of Non-Crystalline Solids, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE and HAL (Le Centre pour la Communication Scientifique Directe).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.