M. Kobrinsky
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Simulation and Numerical Methods
Papers in
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- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 4
- Semiconductor materials and devices 4
- Electromagnetic Compatibility and Noise Suppression 4
- Integrated Circuits and Semiconductor Failure Analysis 3
- Low-power high-performance VLSI design 3
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- Copper Interconnects and Reliability 11
- Co-authors
- Carl V. Thompson (6 shared papers)P. Morrow (1 shared paper)Shriram Ramanathan (1 shared paper)S.D. Senturia (1 shared paper)R. Reif (1 shared paper)Kuan‐Neng Chen (1 shared paper)M. E. Gross (1 shared paper)S. Chakravarty (3 shared papers)
- Journals
- Applied Physics Letters (2 papers)Acta Materialia (2 papers)IEEE Electron Device Letters (1 paper)Physical review. B, Condensed matter (1 paper)Journal of Microelectromechanical Systems (1 paper)
- Partner nations
- United StatesBelgiumIreland
In The Last Decade
M. Kobrinsky
22 papers receiving 558 citations
Peers
Comparison fields: 5 of 41
- Electronic, Optical and Magnetic Materials 156
- Electrical and Electronic Engineering 448
- Mechanics of Materials 155
- Atomic and Molecular Physics, and Optics 148
- Materials Chemistry 101
Countries citing papers authored by M. Kobrinsky
This map shows the geographic impact of M. Kobrinsky's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Kobrinsky with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Kobrinsky more than expected).
Fields of papers citing papers by M. Kobrinsky
This network shows the impact of papers produced by M. Kobrinsky. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Kobrinsky. The network helps show where M. Kobrinsky may publish in the future.
Co-authors
The 25 scholars most cited alongside M. Kobrinsky, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 129 | |
| 2 | 2000 | 66 | |
| 3 | 2004 | 63 | |
| 4 | 2000 | 56 | |
| 5 | 1998 | 52 | |
| 6 | 2001 | 41 | |
| 7 | 2005 | 33 | |
| 8 | 2006 | 30 | |
| 9 | 2003 | 29 | |
| 10 | 2001 | 27 | |
| 11 | 2010 | 13 | |
| 12 | 2003 | 12 | |
| 13 | 2013 | 7 | |
| 14 | 2020 | 5 | |
| 15 | 2000 | 5 | |
| 16 | 2013 | 5 | |
| 17 | 1999 | 2 | |
| 18 | 2020 | 2 | |
| 19 | 2006 | 1 | |
| 20 | 2021 | 1 |
About M. Kobrinsky
M. Kobrinsky is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Biomedical Engineering, having authored 23 papers that have together received 581 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Electronic Packaging and Soldering Technologies (5 papers), Metal and Thin Film Mechanics (4 papers), 3D IC and TSV technologies (4 papers), Semiconductor materials and devices (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Low-power high-performance VLSI design (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (156 citations), Electrical and Electronic Engineering (448 citations), Mechanics of Materials (155 citations), Atomic and Molecular Physics, and Optics (148 citations) and Materials Chemistry (101 citations). M. Kobrinsky has collaborated with scholars based in United States, Belgium and Ireland. Frequent co-authors include Carl V. Thompson, P. Morrow, Shriram Ramanathan, S.D. Senturia, R. Reif, Kuan‐Neng Chen, M. E. Gross, S. Chakravarty, S. List and Dan Jiao. Their work appears in journals such as Applied Physics Letters, Acta Materialia, IEEE Electron Device Letters, Physical review. B, Condensed matter and Journal of Microelectromechanical Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.