D. Lafond
Impact in
- Structural Biology top 5%
-
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
Papers in
-
- Semiconductor materials and devices 50
- Advancements in Semiconductor Devices and Circuit Design 31
- Integrated Circuits and Semiconductor Failure Analysis 14
- Advanced Memory and Neural Computing 9
- 3D IC and TSV technologies 7
- Electronic Packaging and Soldering Technologies 6
-
- Nanowire Synthesis and Applications 13
- Co-authors
- S. Deleonibus (15 shared papers)Jean‐Michel Hartmann (18 shared papers)E. Martínez (9 shared papers)M. Vinet (12 shared papers)G. Molas (9 shared papers)L. Clavelier (7 shared papers)B. Prévitali (11 shared papers)V. Jousseaume (5 shared papers)
- Journals
- Applied Physics Letters (6 papers)Solid-State Electronics (5 papers)Journal of Applied Physics (3 papers)IEEE Electron Device Letters (3 papers)IEEE Transactions on Electron Devices (3 papers)
- Partner nations
- FranceCzechiaSwitzerland
In The Last Decade
D. Lafond
69 papers receiving 1.0k citations
Peers
Comparison fields: 5 of 51
- Structural Biology 29
- Electrical and Electronic Engineering 971
- Materials Chemistry 219
- Atomic and Molecular Physics, and Optics 133
- Surfaces, Coatings and Films 28
Countries citing papers authored by D. Lafond
This map shows the geographic impact of D. Lafond's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Lafond with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Lafond more than expected).
Fields of papers citing papers by D. Lafond
This network shows the impact of papers produced by D. Lafond. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Lafond. The network helps show where D. Lafond may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Lafond, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 71 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 110 | |
| 2 | 2005 | 98 | |
| 3 | 2013 | 68 | |
| 4 | 2009 | 48 | |
| 5 | 2008 | 47 | |
| 6 | 2003 | 37 | |
| 7 | 2009 | 37 | |
| 8 | 2005 | 33 | |
| 9 | 2014 | 33 | |
| 10 | 2008 | 30 | |
| 11 | 2012 | 27 | |
| 12 | 2014 | 23 | |
| 13 | 2006 | 22 | |
| 14 | 2011 | 22 | |
| 15 | 2007 | 22 | |
| 16 | 2009 | 20 | |
| 17 | 2012 | 19 | |
| 18 | 2015 | 19 | |
| 19 | 1998 | 19 | |
| 20 | 2011 | 18 |
About D. Lafond
D. Lafond is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics, Materials Chemistry and Electronic, Optical and Magnetic Materials, having authored 71 papers that have together received 1.1k indexed citations. Recurring topics across this work include Semiconductor materials and devices (50 papers), Advancements in Semiconductor Devices and Circuit Design (31 papers), Integrated Circuits and Semiconductor Failure Analysis (14 papers), Nanowire Synthesis and Applications (13 papers), Advanced Memory and Neural Computing (9 papers), 3D IC and TSV technologies (7 papers), Semiconductor materials and interfaces (6 papers) and Electronic Packaging and Soldering Technologies (6 papers). The work is most often cited by research in Structural Biology (29 citations), Electrical and Electronic Engineering (971 citations), Materials Chemistry (219 citations), Atomic and Molecular Physics, and Optics (133 citations) and Surfaces, Coatings and Films (28 citations). D. Lafond has collaborated with scholars based in France, Czechia and Switzerland. Frequent co-authors include S. Deleonibus, Jean‐Michel Hartmann, E. Martínez, M. Vinet, G. Molas, L. Clavelier, B. Prévitali, V. Jousseaume, G. Audoit and V. Delaye. Their work appears in journals such as Applied Physics Letters, Solid-State Electronics, Journal of Applied Physics, IEEE Electron Device Letters and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.