P. Coudrain
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Hardware and Architecture top 10%
Papers in
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- 3D IC and TSV technologies 35
- Electronic Packaging and Soldering Technologies 21
- Semiconductor materials and devices 8
- Silicon Carbide Semiconductor Technologies 5
- Advancements in Photolithography Techniques 5
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- Heat Transfer and Optimization 6
- Co-authors
- P. Batude (4 shared papers)T. Ernst (2 shared papers)Julien Arcamone (2 shared papers)P.-E. Gaillardon (1 shared paper)L. Di Cioccio (8 shared papers)Yann Beilliard (6 shared papers)Guillaume Parry (2 shared papers)Rafaël Estevez (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Applied Thermal Engineering (1 paper)International Journal of Solids and Structures (1 paper)Journal of Physics D Applied Physics (1 paper)Microelectronic Engineering (1 paper)
- Partner nations
- FranceCanadaSwitzerland
In The Last Decade
P. Coudrain
46 papers receiving 491 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 434
- Hardware and Architecture 32
- Electronic, Optical and Magnetic Materials 64
- Automotive Engineering 39
- Mechanical Engineering 80
Countries citing papers authored by P. Coudrain
This map shows the geographic impact of P. Coudrain's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Coudrain with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Coudrain more than expected).
Fields of papers citing papers by P. Coudrain
This network shows the impact of papers produced by P. Coudrain. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Coudrain. The network helps show where P. Coudrain may publish in the future.
Co-authors
The 25 scholars most cited alongside P. Coudrain, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 48 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 91 | |
| 2 | 2018 | 51 | |
| 3 | 2016 | 37 | |
| 4 | 2014 | 33 | |
| 5 | 3D sequential integration: a key enabling technology for heterogeneous co-integration of new function with CMOS | 2012 | 31 |
| 6 | 2008 | 20 | |
| 7 | 2013 | 17 | |
| 8 | 2014 | 15 | |
| 9 | 2015 | 14 | |
| 10 | 2013 | 13 | |
| 11 | 2009 | 12 | |
| 12 | 2012 | 11 | |
| 13 | 2012 | 11 | |
| 14 | 2016 | 10 | |
| 15 | 2014 | 10 | |
| 16 | 2013 | 9 | |
| 17 | 2011 | 8 | |
| 18 | 2021 | 8 | |
| 19 | 2014 | 7 | |
| 20 | 2018 | 7 |
About P. Coudrain
P. Coudrain is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry, having authored 48 papers that have together received 504 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (21 papers), Semiconductor materials and devices (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Heat Transfer and Optimization (6 papers), Copper Interconnects and Reliability (6 papers), Silicon Carbide Semiconductor Technologies (5 papers) and Advancements in Photolithography Techniques (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (434 citations), Hardware and Architecture (32 citations), Electronic, Optical and Magnetic Materials (64 citations), Automotive Engineering (39 citations) and Mechanical Engineering (80 citations). P. Coudrain has collaborated with scholars based in France, Canada and Switzerland. Frequent co-authors include P. Batude, T. Ernst, Julien Arcamone, P.-E. Gaillardon, L. Di Cioccio, Yann Beilliard, Guillaume Parry, Rafaël Estevez, S. Moreau and Luc G. Fréchette. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Applied Thermal Engineering, International Journal of Solids and Structures, Journal of Physics D Applied Physics and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.