Samuel Suhard
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 25
- Electronic Packaging and Soldering Technologies 17
- Semiconductor materials and devices 10
- Integrated Circuits and Semiconductor Failure Analysis 9
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- Nanofabrication and Lithography Techniques 10
- Advanced Surface Polishing Techniques 7
- Co-authors
- Eric Beyne (23 shared papers)Gerald Beyer (24 shared papers)Alain Phommahaxay (16 shared papers)Pieter Bex (15 shared papers)Koen Kennes (13 shared papers)Fumihiro Inoue (6 shared papers)John Slabbekoorn (7 shared papers)Andy Miller (10 shared papers)
- Journals
- Japanese Journal of Applied Physics (1 paper)Chemical Communications (1 paper)Chemistry of Materials (1 paper)Dalton Transactions (1 paper)Tetrahedron Letters (1 paper)
- Partner nations
- BelgiumUnited StatesFrance
In The Last Decade
Samuel Suhard
44 papers receiving 338 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 268
- Automotive Engineering 55
- Electronic, Optical and Magnetic Materials 46
- Biomedical Engineering 95
- Industrial and Manufacturing Engineering 18
Countries citing papers authored by Samuel Suhard
This map shows the geographic impact of Samuel Suhard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Samuel Suhard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Samuel Suhard more than expected).
Fields of papers citing papers by Samuel Suhard
This network shows the impact of papers produced by Samuel Suhard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Samuel Suhard. The network helps show where Samuel Suhard may publish in the future.
Co-authors
The 25 scholars most cited alongside Samuel Suhard, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 48 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 38 | |
| 2 | 2019 | 34 | |
| 3 | 2016 | 23 | |
| 4 | 2019 | 20 | |
| 5 | 2020 | 18 | |
| 6 | 2018 | 17 | |
| 7 | 2019 | 16 | |
| 8 | 2010 | 16 | |
| 9 | 2021 | 14 | |
| 10 | 2021 | 14 | |
| 11 | 2020 | 12 | |
| 12 | 2019 | 12 | |
| 13 | 2022 | 11 | |
| 14 | 2010 | 9 | |
| 15 | 2016 | 9 | |
| 16 | 2024 | 9 | |
| 17 | 2009 | 7 | |
| 18 | 2008 | 7 | |
| 19 | 2012 | 7 | |
| 20 | 2009 | 7 |
About Samuel Suhard
Samuel Suhard is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials and Organic Chemistry, having authored 48 papers that have together received 355 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor materials and devices (10 papers), Nanofabrication and Lithography Techniques (10 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Copper Interconnects and Reliability (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers) and Advanced Surface Polishing Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (268 citations), Automotive Engineering (55 citations), Electronic, Optical and Magnetic Materials (46 citations), Biomedical Engineering (95 citations) and Industrial and Manufacturing Engineering (18 citations). Samuel Suhard has collaborated with scholars based in Belgium, United States and France. Frequent co-authors include Eric Beyne, Gerald Beyer, Alain Phommahaxay, Pieter Bex, Koen Kennes, Fumihiro Inoue, John Slabbekoorn, Andy Miller, Bruno Chaudret and Erik Sleeckx. Their work appears in journals such as Japanese Journal of Applied Physics, Chemical Communications, Chemistry of Materials, Dalton Transactions and Tetrahedron Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.