D. Canaperi
Impact in
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- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
Papers in
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- Semiconductor materials and devices 31
- Integrated Circuits and Semiconductor Failure Analysis 13
- Advancements in Semiconductor Devices and Circuit Design 12
- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 4
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- Copper Interconnects and Reliability 23
- Co-authors
- Steven J. Koester (9 shared papers)J. O. Chu (8 shared papers)C. D’Emic (3 shared papers)Ron Anderson (3 shared papers)H.‐S. Philip Wong (3 shared papers)R. Patlolla (6 shared papers)E. Liniger (11 shared papers)Lida Huang (1 shared paper)
- Journals
- ECS Journal of Solid State Science and Technology (4 papers)Microelectronic Engineering (4 papers)IEEE Electron Device Letters (3 papers)Applied Physics Letters (2 papers)IEEE Transactions on Magnetics (1 paper)
- Partner nations
- United StatesSwitzerlandGermany
In The Last Decade
D. Canaperi
43 papers receiving 628 citations
Peers
Comparison fields: 5 of 31
- Electronic, Optical and Magnetic Materials 235
- Electrical and Electronic Engineering 599
- Atomic and Molecular Physics, and Optics 116
- Biomedical Engineering 151
- Mechanics of Materials 70
Countries citing papers authored by D. Canaperi
This map shows the geographic impact of D. Canaperi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Canaperi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Canaperi more than expected).
Fields of papers citing papers by D. Canaperi
This network shows the impact of papers produced by D. Canaperi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Canaperi. The network helps show where D. Canaperi may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Canaperi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 45 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 103 | |
| 2 | 2001 | 78 | |
| 3 | 2013 | 46 | |
| 4 | 2002 | 43 | |
| 5 | 2016 | 38 | |
| 6 | 2004 | 37 | |
| 7 | 2004 | 35 | |
| 8 | 2005 | 29 | |
| 9 | 2005 | 27 | |
| 10 | 2002 | 23 | |
| 11 | 2010 | 18 | |
| 12 | 2017 | 16 | |
| 13 | 2017 | 14 | |
| 14 | 2018 | 12 | |
| 15 | 2003 | 11 | |
| 16 | 2014 | 11 | |
| 17 | 1988 | 11 | |
| 18 | 2012 | 10 | |
| 19 | 2011 | 10 | |
| 20 | 2005 | 9 |
About D. Canaperi
D. Canaperi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 45 papers that have together received 677 indexed citations. Recurring topics across this work include Semiconductor materials and devices (31 papers), Copper Interconnects and Reliability (23 papers), Integrated Circuits and Semiconductor Failure Analysis (13 papers), Advancements in Semiconductor Devices and Circuit Design (12 papers), Electronic Packaging and Soldering Technologies (10 papers), Advanced Surface Polishing Techniques (8 papers), Metal and Thin Film Mechanics (5 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (235 citations), Electrical and Electronic Engineering (599 citations), Atomic and Molecular Physics, and Optics (116 citations), Biomedical Engineering (151 citations) and Mechanics of Materials (70 citations). D. Canaperi has collaborated with scholars based in United States, Switzerland and Germany. Frequent co-authors include Steven J. Koester, J. O. Chu, C. D’Emic, Ron Anderson, H.‐S. Philip Wong, R. Patlolla, E. Liniger, Lida Huang, Soon‐Cheon Seo and Sharon L. Smith. Their work appears in journals such as ECS Journal of Solid State Science and Technology, Microelectronic Engineering, IEEE Electron Device Letters, Applied Physics Letters and IEEE Transactions on Magnetics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.