D. Canaperi
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
Papers in
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- Semiconductor materials and devices 33
- Integrated Circuits and Semiconductor Failure Analysis 13
- Advancements in Semiconductor Devices and Circuit Design 12
- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 4
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- Copper Interconnects and Reliability 25
- Co-authors
- Steven J. Koester (9 shared papers)J. O. Chu (8 shared papers)C. D’Emic (3 shared papers)Ron Anderson (3 shared papers)H.‐S. Philip Wong (3 shared papers)E. Liniger (12 shared papers)R. Patlolla (6 shared papers)Lida Huang (1 shared paper)
- Journals
- Microelectronic Engineering (4 papers)ECS Journal of Solid State Science and Technology (4 papers)IEEE Electron Device Letters (3 papers)Applied Physics Letters (2 papers)Comptes Rendus Chimie (1 paper)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
D. Canaperi
44 papers receiving 685 citations
Peers
Comparison fields: 5 of 33
- Electronic, Optical and Magnetic Materials 259
- Electrical and Electronic Engineering 657
- Biomedical Engineering 170
- Atomic and Molecular Physics, and Optics 119
- Mechanics of Materials 82
Countries citing papers authored by D. Canaperi
This map shows the geographic impact of D. Canaperi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Canaperi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Canaperi more than expected).
Fields of papers citing papers by D. Canaperi
This network shows the impact of papers produced by D. Canaperi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Canaperi. The network helps show where D. Canaperi may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Canaperi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 114 | |
| 2 | 2001 | 85 | |
| 3 | 2013 | 48 | |
| 4 | 2004 | 45 | |
| 5 | 2002 | 44 | |
| 6 | 2016 | 39 | |
| 7 | 2004 | 35 | |
| 8 | 2005 | 34 | |
| 9 | 2005 | 27 | |
| 10 | 2002 | 25 | |
| 11 | 2010 | 19 | |
| 12 | 2017 | 17 | |
| 13 | 2017 | 15 | |
| 14 | 1988 | 12 | |
| 15 | 2018 | 12 | |
| 16 | 2014 | 12 | |
| 17 | 2003 | 12 | |
| 18 | 2012 | 12 | |
| 19 | 2011 | 11 | |
| 20 | 2017 | 10 |
About D. Canaperi
D. Canaperi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 47 papers that have together received 742 indexed citations. Recurring topics across this work include Semiconductor materials and devices (33 papers), Copper Interconnects and Reliability (25 papers), Integrated Circuits and Semiconductor Failure Analysis (13 papers), Advancements in Semiconductor Devices and Circuit Design (12 papers), Electronic Packaging and Soldering Technologies (10 papers), Advanced Surface Polishing Techniques (9 papers), Metal and Thin Film Mechanics (6 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (259 citations), Electrical and Electronic Engineering (657 citations), Biomedical Engineering (170 citations), Atomic and Molecular Physics, and Optics (119 citations) and Mechanics of Materials (82 citations). D. Canaperi has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include Steven J. Koester, J. O. Chu, C. D’Emic, Ron Anderson, H.‐S. Philip Wong, E. Liniger, R. Patlolla, Lida Huang, Soon‐Cheon Seo and J. Germán Rubino. Their work appears in journals such as Microelectronic Engineering, ECS Journal of Solid State Science and Technology, IEEE Electron Device Letters, Applied Physics Letters and Comptes Rendus Chimie.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.