D.L. Rath
Impact in
- Electrochemistry top 5%
- Electrochemical Analysis and Applications
- Surfaces, Coatings and Films top 10%
- Electron and X-Ray Spectroscopy Techniques
Papers in
-
- Semiconductor materials and devices 9
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 3
- Electrodeposition and Electroless Coatings 3
-
- Copper Interconnects and Reliability 9
- Co-authors
- D.M. Kolb (4 shared papers)Wilford N. Hansen (3 shared papers)R.A. Wille (2 shared papers)Peter Kolb (1 shared paper)A. Simon (3 shared papers)E. Liniger (3 shared papers)S. Kaldor (3 shared papers)Wei‐Tsu Tseng (3 shared papers)
- Journals
- Surface Science (4 papers)Thin Solid Films (2 papers)Applied Physics Letters (1 paper)IBM Journal of Research and Development (1 paper)Journal of The Electrochemical Society (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
D.L. Rath
22 papers receiving 523 citations
Peers
Comparison fields: 5 of 44
- Electrochemistry 182
- Surfaces, Coatings and Films 86
- Electronic, Optical and Magnetic Materials 178
- Bioengineering 49
- Electrical and Electronic Engineering 342
Countries citing papers authored by D.L. Rath
This map shows the geographic impact of D.L. Rath's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.L. Rath with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.L. Rath more than expected).
Fields of papers citing papers by D.L. Rath
This network shows the impact of papers produced by D.L. Rath. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.L. Rath. The network helps show where D.L. Rath may publish in the future.
Co-authors
The 25 scholars most cited alongside D.L. Rath, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1983 | 92 | |
| 2 | 2003 | 86 | |
| 3 | 1981 | 67 | |
| 4 | 1980 | 59 | |
| 5 | 2004 | 37 | |
| 6 | 1984 | 34 | |
| 7 | 1980 | 28 | |
| 8 | 2005 | 27 | |
| 9 | 1983 | 24 | |
| 10 | 1984 | 21 | |
| 11 | 2001 | 19 | |
| 12 | 1988 | 11 | |
| 13 | 1988 | 9 | |
| 14 | 1981 | 9 | |
| 15 | 2005 | 7 | |
| 16 | 2001 | 5 | |
| 17 | Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages | 2006 | 5 |
| 18 | 2014 | 3 | |
| 19 | 2013 | 1 | |
| 20 | 2001 | 1 |
About D.L. Rath
D.L. Rath is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Surfaces, Coatings and Films and Atomic and Molecular Physics, and Optics, having authored 24 papers that have together received 547 indexed citations. Recurring topics across this work include Semiconductor materials and devices (9 papers), Copper Interconnects and Reliability (9 papers), Electron and X-Ray Spectroscopy Techniques (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Corrosion Behavior and Inhibition (3 papers), 3D IC and TSV technologies (3 papers), Electrodeposition and Electroless Coatings (3 papers) and Metal and Thin Film Mechanics (2 papers). The work is most often cited by research in Electrochemistry (182 citations), Surfaces, Coatings and Films (86 citations), Electronic, Optical and Magnetic Materials (178 citations), Bioengineering (49 citations) and Electrical and Electronic Engineering (342 citations). D.L. Rath has collaborated with scholars based in United States and Germany. Frequent co-authors include D.M. Kolb, Wilford N. Hansen, R.A. Wille, Peter Kolb, A. Simon, E. Liniger, S. Kaldor, Wei‐Tsu Tseng, L. Gignac and C.‐K. Hu. Their work appears in journals such as Surface Science, Thin Solid Films, Applied Physics Letters, IBM Journal of Research and Development and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.