Paul Andry
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 2%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 52
- Electronic Packaging and Soldering Technologies 32
- Semiconductor materials and devices 21
- Thin-Film Transistor Technologies 12
- Electrical and Thermal Properties of Materials 8
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- Additive Manufacturing and 3D Printing Technologies 11
- Co-authors
- Cornelia Tsang (38 shared papers)John Knickerbocker (37 shared papers)S. L. Wright (23 shared papers)R. Polastre (23 shared papers)E. Sprogis (21 shared papers)Bucknell C. Webb (15 shared papers)B. Dang (17 shared papers)R. Horton (15 shared papers)
- Journals
- IBM Journal of Research and Development (5 papers)Applied Physics Letters (2 papers)Journal of Applied Physics (2 papers)IEEE Journal of Solid-State Circuits (2 papers)Journal of the Society for Information Display (1 paper)
- Partner nations
- United StatesJapanCanada
In The Last Decade
Paul Andry
63 papers receiving 2.5k citations
Paul Andry's Hit Papers
Peers
Comparison fields: 5 of 53
- Electrical and Electronic Engineering 2.4k
- Automotive Engineering 407
- Hardware and Architecture 158
- Electronic, Optical and Magnetic Materials 211
- Biomedical Engineering 383
Countries citing papers authored by Paul Andry
This map shows the geographic impact of Paul Andry's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul Andry with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul Andry more than expected).
Fields of papers citing papers by Paul Andry
This network shows the impact of papers produced by Paul Andry. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul Andry. The network helps show where Paul Andry may publish in the future.
Co-authors
The 25 scholars most cited alongside Paul Andry, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 64 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 401 |
| 2 | 2005 | 200 | |
| 3 | 2008 | 185 | |
| 4 | 2006 | 152 | |
| 5 | 2008 | 126 | |
| 6 | 2007 | 94 | |
| 7 | 2008 | 94 | |
| 8 | 2011 | 93 | |
| 9 | 2012 | 86 | |
| 10 | Thin-Film Transistors | 2007 | 75 |
| 11 | 2006 | 73 | |
| 12 | 2006 | 70 | |
| 13 | 2007 | 70 | |
| 14 | 2010 | 53 | |
| 15 | 2006 | 53 | |
| 16 | 2012 | 52 | |
| 17 | 2008 | 39 | |
| 18 | 1996 | 37 | |
| 19 | 2010 | 36 | |
| 20 | 2006 | 36 |
About Paul Andry
Paul Andry is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 64 papers that have together received 2.6k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (52 papers), Electronic Packaging and Soldering Technologies (32 papers), Semiconductor materials and devices (21 papers), Thin-Film Transistor Technologies (12 papers), Additive Manufacturing and 3D Printing Technologies (11 papers), Electrical and Thermal Properties of Materials (8 papers), Advanced Surface Polishing Techniques (7 papers) and Semiconductor materials and interfaces (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.4k citations), Automotive Engineering (407 citations), Hardware and Architecture (158 citations), Electronic, Optical and Magnetic Materials (211 citations) and Biomedical Engineering (383 citations). Paul Andry has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Cornelia Tsang, John Knickerbocker, S. L. Wright, R. Polastre, E. Sprogis, Bucknell C. Webb, B. Dang, R. Horton, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, Applied Physics Letters, Journal of Applied Physics, IEEE Journal of Solid-State Circuits and Journal of the Society for Information Display.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.