E. Sprogis
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 23
- Electronic Packaging and Soldering Technologies 16
- Semiconductor materials and devices 13
- Integrated Circuits and Semiconductor Failure Analysis 5
- Silicon and Solar Cell Technologies 4
- Advancements in Semiconductor Devices and Circuit Design 4
- Electrical and Thermal Properties of Materials 4
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- Semiconductor materials and interfaces 3
- Co-authors
- Paul Andry (21 shared papers)Cornelia Tsang (20 shared papers)S. L. Wright (15 shared papers)John Knickerbocker (17 shared papers)Bucknell C. Webb (9 shared papers)R. Polastre (12 shared papers)R. Horton (11 shared papers)B. Dang (8 shared papers)
- Journals
- IBM Journal of Research and Development (6 papers)IEEE Electron Device Letters (2 papers)IEEE Journal of Solid-State Circuits (2 papers)MRS Proceedings (1 paper)
- Partner nations
- United StatesJapanCanada
In The Last Decade
E. Sprogis
30 papers receiving 1.7k citations
E. Sprogis's Hit Papers
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 1.7k
- Automotive Engineering 268
- Hardware and Architecture 103
- Electronic, Optical and Magnetic Materials 153
- Biomedical Engineering 247
Countries citing papers authored by E. Sprogis
This map shows the geographic impact of E. Sprogis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Sprogis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Sprogis more than expected).
Fields of papers citing papers by E. Sprogis
This network shows the impact of papers produced by E. Sprogis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Sprogis. The network helps show where E. Sprogis may publish in the future.
Co-authors
The 25 scholars most cited alongside E. Sprogis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 31 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 401 |
| 2 | 2005 | 200 | |
| 3 | 2006 | 152 | |
| 4 | 2008 | 139 | |
| 5 | 2008 | 126 | |
| 6 | 2008 | 94 | |
| 7 | 2011 | 93 | |
| 8 | 2006 | 73 | |
| 9 | 2006 | 70 | |
| 10 | 2007 | 70 | |
| 11 | 1986 | 47 | |
| 12 | 2008 | 39 | |
| 13 | 2006 | 36 | |
| 14 | 2008 | 32 | |
| 15 | 2005 | 29 | |
| 16 | 2006 | 22 | |
| 17 | 2017 | 21 | |
| 18 | 1985 | 18 | |
| 19 | 2010 | 17 | |
| 20 | 2006 | 15 |
About E. Sprogis
E. Sprogis is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Automotive Engineering, Hardware and Architecture and Electronic, Optical and Magnetic Materials, having authored 31 papers that have together received 1.8k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (16 papers), Semiconductor materials and devices (13 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Silicon and Solar Cell Technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Electrical and Thermal Properties of Materials (4 papers) and Semiconductor materials and interfaces (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (268 citations), Hardware and Architecture (103 citations), Electronic, Optical and Magnetic Materials (153 citations) and Biomedical Engineering (247 citations). E. Sprogis has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker, Bucknell C. Webb, R. Polastre, R. Horton, B. Dang, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Electron Device Letters, IEEE Journal of Solid-State Circuits and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.