E. Todd Ryan
Impact in
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- Copper Interconnects and Reliability
- Mechanics of Materials top 2%
- Muon and positron interactions and applications
- Metal and Thin Film Mechanics
Papers in
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- Semiconductor materials and devices 41
- Electronic Packaging and Soldering Technologies 6
-
- Copper Interconnects and Reliability 48
- Co-authors
- Paul S. Ho (8 shared papers)David W. Gidley (7 shared papers)Jie-Hua Zhao (1 shared paper)Michael Morgen (1 shared paper)Chuan Hu (1 shared paper)Taiheui Cho (2 shared papers)W. E. Frieze (3 shared papers)T. L. Dull (2 shared papers)
- Journals
- Applied Physics Letters (8 papers)Journal of Applied Physics (7 papers)Journal of The Electrochemical Society (3 papers)The Journal of Chemical Physics (3 papers)AIP Advances (2 papers)
- Partner nations
- United StatesGermanyCanada
In The Last Decade
E. Todd Ryan
63 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 70
- Electronic, Optical and Magnetic Materials 849
- Mechanics of Materials 602
- Ceramics and Composites 138
- Electrical and Electronic Engineering 926
- Inorganic Chemistry 195
Countries citing papers authored by E. Todd Ryan
This map shows the geographic impact of E. Todd Ryan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Todd Ryan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Todd Ryan more than expected).
Fields of papers citing papers by E. Todd Ryan
This network shows the impact of papers produced by E. Todd Ryan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Todd Ryan. The network helps show where E. Todd Ryan may publish in the future.
Co-authors
The 25 scholars most cited alongside E. Todd Ryan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 64 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 334 | |
| 2 | 1999 | 251 | |
| 3 | 2006 | 133 | |
| 4 | 2000 | 120 | |
| 5 | 1997 | 79 | |
| 6 | 2001 | 54 | |
| 7 | 2004 | 52 | |
| 8 | 2009 | 51 | |
| 9 | 2019 | 49 | |
| 10 | 1997 | 46 | |
| 11 | 2008 | 45 | |
| 12 | 2002 | 39 | |
| 13 | 2016 | 39 | |
| 14 | 2017 | 34 | |
| 15 | 1996 | 26 | |
| 16 | 2006 | 26 | |
| 17 | 1995 | 25 | |
| 18 | 2019 | 24 | |
| 19 | 2001 | 20 | |
| 20 | 1993 | 20 |
About E. Todd Ryan
E. Todd Ryan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 64 papers that have together received 1.7k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (48 papers), Semiconductor materials and devices (41 papers), Metal and Thin Film Mechanics (15 papers), Muon and positron interactions and applications (8 papers), Advanced ceramic materials synthesis (7 papers), Electronic Packaging and Soldering Technologies (6 papers), Semiconductor materials and interfaces (5 papers) and Atmospheric Ozone and Climate (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (849 citations), Mechanics of Materials (602 citations), Ceramics and Composites (138 citations), Electrical and Electronic Engineering (926 citations) and Inorganic Chemistry (195 citations). E. Todd Ryan has collaborated with scholars based in United States, Germany and Canada. Frequent co-authors include Paul S. Ho, David W. Gidley, Jie-Hua Zhao, Michael Morgen, Chuan Hu, Taiheui Cho, W. E. Frieze, T. L. Dull, Albert F. Yee and Eric Weitz. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Journal of The Electrochemical Society, The Journal of Chemical Physics and AIP Advances.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.