D. Restaino
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrodeposition and Electroless Coatings
Papers in
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- Copper Interconnects and Reliability 10
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- Electronic Packaging and Soldering Technologies 5
- Electrodeposition and Electroless Coatings 2
- Semiconductor materials and devices 2
- Silicon and Solar Cell Technologies 1
- Co-authors
- Soon‐Cheon Seo (3 shared papers)J. Germán Rubino (3 shared papers)Sharon L. Smith (3 shared papers)D. Canaperi (3 shared papers)R. Rosenberg (3 shared papers)Lynne Gignac (2 shared papers)S. James Gates (2 shared papers)Michael A. Lane (1 shared paper)
- Journals
- Thin Solid Films (3 papers)Journal of The Electrochemical Society (2 papers)Journal of Applied Physics (1 paper)Applied Physics Letters (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
D. Restaino
11 papers receiving 175 citations
Peers
Comparison fields: 5 of 21
- Electronic, Optical and Magnetic Materials 143
- Electrical and Electronic Engineering 166
- Ceramics and Composites 10
- Mechanics of Materials 38
- Atomic and Molecular Physics, and Optics 27
Countries citing papers authored by D. Restaino
This map shows the geographic impact of D. Restaino's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Restaino with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Restaino more than expected).
Fields of papers citing papers by D. Restaino
This network shows the impact of papers produced by D. Restaino. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Restaino. The network helps show where D. Restaino may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Restaino, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 45 | |
| 2 | 2004 | 35 | |
| 3 | 2008 | 35 | |
| 4 | 2005 | 27 | |
| 5 | 1999 | 10 | |
| 6 | 1999 | 9 | |
| 7 | 1994 | 7 | |
| 8 | 1997 | 6 | |
| 9 | 2004 | 5 | |
| 10 | 2008 | 5 | |
| 11 | 1998 | 5 |
About D. Restaino
D. Restaino is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Biomedical Engineering and Materials Chemistry, having authored 11 papers that have together received 189 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (5 papers), Metal and Thin Film Mechanics (2 papers), Electrodeposition and Electroless Coatings (2 papers), Semiconductor materials and devices (2 papers), Advanced Surface Polishing Techniques (2 papers), Silicone and Siloxane Chemistry (2 papers) and Silicon and Solar Cell Technologies (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (143 citations), Electrical and Electronic Engineering (166 citations), Ceramics and Composites (10 citations), Mechanics of Materials (38 citations) and Atomic and Molecular Physics, and Optics (27 citations). D. Restaino has collaborated with scholars based in United States and Germany. Frequent co-authors include Soon‐Cheon Seo, J. Germán Rubino, Sharon L. Smith, D. Canaperi, R. Rosenberg, Lynne Gignac, S. James Gates, Michael A. Lane, S. Molis and D. Edelstein. Their work appears in journals such as Thin Solid Films, Journal of The Electrochemical Society, Journal of Applied Physics, Applied Physics Letters and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.