C.-C. Yang
Impact in
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- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
Papers in
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- Semiconductor materials and devices 28
- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 4
- Electrodeposition and Electroless Coatings 3
- Silicon and Solar Cell Technologies 1
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- Copper Interconnects and Reliability 32
- Co-authors
- D. Edelstein (19 shared papers)T. Nogami (4 shared papers)C. Christiansen (2 shared papers)Baozhen Li (1 shared paper)D. Badami (1 shared paper)Sidney Cohen (2 shared papers)T. M. Shaw (1 shared paper)R. Rosenberg (5 shared papers)
- Journals
- IEEE Electron Device Letters (13 papers)Applied Physics Letters (3 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)Microelectronics Reliability (1 paper)Microelectronic Engineering (1 paper)
- Partner nations
- United StatesSwitzerlandTaiwan
In The Last Decade
C.-C. Yang
37 papers receiving 531 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 370
- Electrical and Electronic Engineering 471
- Process Chemistry and Technology 15
- Mechanics of Materials 80
- Atomic and Molecular Physics, and Optics 73
Countries citing papers authored by C.-C. Yang
This map shows the geographic impact of C.-C. Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-C. Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-C. Yang more than expected).
Fields of papers citing papers by C.-C. Yang
This network shows the impact of papers produced by C.-C. Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-C. Yang. The network helps show where C.-C. Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside C.-C. Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 37 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 81 | |
| 2 | 2014 | 64 | |
| 3 | 2007 | 40 | |
| 4 | 2019 | 39 | |
| 5 | 2013 | 35 | |
| 6 | 2010 | 30 | |
| 7 | 2011 | 25 | |
| 8 | 2020 | 19 | |
| 9 | 2018 | 17 | |
| 10 | 2012 | 17 | |
| 11 | 2011 | 14 | |
| 12 | 2009 | 14 | |
| 13 | 2012 | 13 | |
| 14 | 2016 | 13 | |
| 15 | 2010 | 13 | |
| 16 | 2011 | 12 | |
| 17 | 2017 | 12 | |
| 18 | 2019 | 11 | |
| 19 | 2014 | 11 | |
| 20 | 2011 | 11 |
About C.-C. Yang
C.-C. Yang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 37 papers that have together received 564 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (32 papers), Semiconductor materials and devices (28 papers), Electronic Packaging and Soldering Technologies (21 papers), Metal and Thin Film Mechanics (5 papers), Semiconductor materials and interfaces (5 papers), 3D IC and TSV technologies (4 papers), Electrodeposition and Electroless Coatings (3 papers) and Silicon and Solar Cell Technologies (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (370 citations), Electrical and Electronic Engineering (471 citations), Process Chemistry and Technology (15 citations), Mechanics of Materials (80 citations) and Atomic and Molecular Physics, and Optics (73 citations). C.-C. Yang has collaborated with scholars based in United States, Switzerland and Taiwan. Frequent co-authors include D. Edelstein, T. Nogami, C. Christiansen, Baozhen Li, D. Badami, Sidney Cohen, T. M. Shaw, R. Rosenberg, Nicholas A. Lanzillo and Huai Huang. Their work appears in journals such as IEEE Electron Device Letters, Applied Physics Letters, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, Microelectronics Reliability and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.