L.P. Buchwalter
Impact in
- Polymers and Plastics top 5%
- Synthesis and properties of polymers
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
Papers in
-
- Synthesis and properties of polymers 16
- Polymer Nanocomposites and Properties 3
-
- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 8
- Integrated Circuits and Semiconductor Failure Analysis 3
- Semiconductor materials and devices 3
- Co-authors
- John Knickerbocker (7 shared papers)Cornelia Tsang (7 shared papers)R. Horton (7 shared papers)Paul Andry (7 shared papers)E. Sprogis (6 shared papers)R. Polastre (6 shared papers)S. L. Wright (6 shared papers)C.S. Patel (5 shared papers)
- Journals
- Journal of Adhesion Science and Technology (13 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (3 papers)The Journal of Adhesion (2 papers)Journal of Electronic Materials (2 papers)Journal of Applied Polymer Science (1 paper)
- Partner nations
- United StatesSouth Korea
In The Last Decade
L.P. Buchwalter
33 papers receiving 1.0k citations
Peers
Comparison fields: 5 of 61
- Polymers and Plastics 232
- Electrical and Electronic Engineering 777
- Surfaces, Coatings and Films 72
- Electronic, Optical and Magnetic Materials 135
- Mechanics of Materials 146
Countries citing papers authored by L.P. Buchwalter
This map shows the geographic impact of L.P. Buchwalter's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.P. Buchwalter with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.P. Buchwalter more than expected).
Fields of papers citing papers by L.P. Buchwalter
This network shows the impact of papers produced by L.P. Buchwalter. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.P. Buchwalter. The network helps show where L.P. Buchwalter may publish in the future.
Co-authors
The 25 scholars most cited alongside L.P. Buchwalter, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 200 | |
| 2 | 2006 | 152 | |
| 3 | 2006 | 73 | |
| 4 | 1994 | 62 | |
| 5 | 1990 | 60 | |
| 6 | 1992 | 54 | |
| 7 | 1990 | 42 | |
| 8 | 2006 | 36 | |
| 9 | 1987 | 33 | |
| 10 | 2005 | 29 | |
| 11 | 1986 | 29 | |
| 12 | 1992 | 21 | |
| 13 | 1997 | 20 | |
| 14 | 2006 | 20 | |
| 15 | 2004 | 18 | |
| 16 | 1990 | 18 | |
| 17 | 1989 | 17 | |
| 18 | 1998 | 16 | |
| 19 | 1988 | 16 | |
| 20 | 1995 | 16 |
About L.P. Buchwalter
L.P. Buchwalter is a scholar working on Polymers and Plastics, Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials and Electronic, Optical and Magnetic Materials, having authored 33 papers that have together received 1.0k indexed citations. Recurring topics across this work include Synthesis and properties of polymers (16 papers), Silicone and Siloxane Chemistry (10 papers), Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers), Copper Interconnects and Reliability (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Polymer Nanocomposites and Properties (3 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Polymers and Plastics (232 citations), Electrical and Electronic Engineering (777 citations), Surfaces, Coatings and Films (72 citations), Electronic, Optical and Magnetic Materials (135 citations) and Mechanics of Materials (146 citations). L.P. Buchwalter has collaborated with scholars based in United States and South Korea. Frequent co-authors include John Knickerbocker, Cornelia Tsang, R. Horton, Paul Andry, E. Sprogis, R. Polastre, S. L. Wright, C.S. Patel, H. Gan and George Czornyj. Their work appears in journals such as Journal of Adhesion Science and Technology, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, The Journal of Adhesion, Journal of Electronic Materials and Journal of Applied Polymer Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.