T. Spooner
About
T. Spooner has authored 22 papers that have received a total of 216 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 7 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (7 papers). T. Spooner is often cited by papers focused on Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (13 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in United States, Ireland and Japan. T. Spooner's co-authors include H. Shobha, E. Liniger, Griselda Bonilla, Alshakim Nelson and R. Wisnieff and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Physics D Applied Physics.
In The Last Decade
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