T. Spooner
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electrodeposition and Electroless Coatings
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 36
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 10
- Advancements in Photolithography Techniques 6
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- Copper Interconnects and Reliability 44
- Co-authors
- D. Edelstein (11 shared papers)T. Nogami (4 shared papers)James J. Kelly (5 shared papers)Huai Huang (8 shared papers)Linlin Zhao (1 shared paper)Meng‐Dong He (1 shared paper)Xingxing Zhang (1 shared paper)T. Standaert (5 shared papers)
- Journals
- Journal of The Electrochemical Society (3 papers)Microelectronic Engineering (3 papers)Applied Physics Letters (2 papers)IEEE Electron Device Letters (1 paper)Berichte der Bunsengesellschaft für physikalische Chemie (1 paper)
- Partner nations
- United StatesJapanGermany
In The Last Decade
T. Spooner
45 papers receiving 471 citations
Peers
Comparison fields: 5 of 32
- Electronic, Optical and Magnetic Materials 332
- Electrical and Electronic Engineering 436
- Atomic and Molecular Physics, and Optics 113
- Mechanics of Materials 84
- Materials Chemistry 84
Countries citing papers authored by T. Spooner
This map shows the geographic impact of T. Spooner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Spooner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Spooner more than expected).
Fields of papers citing papers by T. Spooner
This network shows the impact of papers produced by T. Spooner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Spooner. The network helps show where T. Spooner may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Spooner, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 51 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 93 | |
| 2 | 2016 | 45 | |
| 3 | 2016 | 39 | |
| 4 | 2014 | 33 | |
| 5 | 2006 | 33 | |
| 6 | 2008 | 23 | |
| 7 | 2018 | 17 | |
| 8 | 2011 | 17 | |
| 9 | 2017 | 15 | |
| 10 | 2020 | 13 | |
| 11 | 2016 | 13 | |
| 12 | 2011 | 13 | |
| 13 | 2017 | 12 | |
| 14 | 2016 | 11 | |
| 15 | 2012 | 11 | |
| 16 | 2009 | 9 | |
| 17 | 2018 | 9 | |
| 18 | 1995 | 7 | |
| 19 | 1993 | 6 | |
| 20 | 2007 | 6 |
About T. Spooner
T. Spooner is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Biomedical Engineering, having authored 51 papers that have together received 502 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (44 papers), Semiconductor materials and devices (36 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor materials and interfaces (10 papers), 3D IC and TSV technologies (10 papers), Advancements in Photolithography Techniques (6 papers), Metal and Thin Film Mechanics (5 papers) and Nanofabrication and Lithography Techniques (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (332 citations), Electrical and Electronic Engineering (436 citations), Atomic and Molecular Physics, and Optics (113 citations), Mechanics of Materials (84 citations) and Materials Chemistry (84 citations). T. Spooner has collaborated with scholars based in United States, Japan and Germany. Frequent co-authors include D. Edelstein, T. Nogami, James J. Kelly, Huai Huang, Linlin Zhao, Meng‐Dong He, Xingxing Zhang, T. Standaert, H. Shobha and Griselda Bonilla. Their work appears in journals such as Journal of The Electrochemical Society, Microelectronic Engineering, Applied Physics Letters, IEEE Electron Device Letters and Berichte der Bunsengesellschaft für physikalische Chemie.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.