D. Edelstein
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Radio Frequency Integrated Circuit Design
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
Papers in
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- Semiconductor materials and devices 52
- Electronic Packaging and Soldering Technologies 32
- 3D IC and TSV technologies 17
- Integrated Circuits and Semiconductor Failure Analysis 8
- Radio Frequency Integrated Circuit Design 6
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- Copper Interconnects and Reliability 57
- Co-authors
- R. Rosenberg (7 shared papers)C.‐K. Hu (4 shared papers)K. P. Rodbell (1 shared paper)Joachim N. Burghartz (6 shared papers)C.-C. Yang (19 shared papers)K.A. Jenkins (4 shared papers)M. Soyuer (3 shared papers)G.A. Sai-Halasz (1 shared paper)
- Journals
- IEEE Electron Device Letters (12 papers)Journal of Applied Polymer Science (4 papers)Applied Physics Letters (3 papers)Journal of Applied Physics (3 papers)Electrochemical and Solid-State Letters (2 papers)
- Partner nations
- United StatesIsraelGermany
In The Last Decade
D. Edelstein
81 papers receiving 2.0k citations
Peers
Comparison fields: 5 of 70
- Electronic, Optical and Magnetic Materials 1.1k
- Electrical and Electronic Engineering 1.9k
- Mechanics of Materials 271
- Hardware and Architecture 74
- Atomic and Molecular Physics, and Optics 260
Countries citing papers authored by D. Edelstein
This map shows the geographic impact of D. Edelstein's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Edelstein with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Edelstein more than expected).
Fields of papers citing papers by D. Edelstein
This network shows the impact of papers produced by D. Edelstein. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Edelstein. The network helps show where D. Edelstein may publish in the future.
Co-authors
The 25 scholars most cited alongside D. Edelstein, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 86 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 347 | |
| 2 | 2002 | 196 | |
| 3 | 1998 | 165 | |
| 4 | 2001 | 149 | |
| 5 | 1997 | 110 | |
| 6 | 1995 | 99 | |
| 7 | 2013 | 93 | |
| 8 | 2008 | 75 | |
| 9 | 2010 | 69 | |
| 10 | 2001 | 63 | |
| 11 | 2016 | 43 | |
| 12 | 2012 | 40 | |
| 13 | 2016 | 38 | |
| 14 | 2008 | 34 | |
| 15 | 2002 | 34 | |
| 16 | 2006 | 31 | |
| 17 | 2010 | 30 | |
| 18 | 2005 | 29 | |
| 19 | 2002 | 25 | |
| 20 | 2011 | 24 |
About D. Edelstein
D. Edelstein is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Biomedical Engineering, having authored 86 papers that have together received 2.2k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (57 papers), Semiconductor materials and devices (52 papers), Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (17 papers), Semiconductor materials and interfaces (8 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Metal and Thin Film Mechanics (7 papers) and Radio Frequency Integrated Circuit Design (6 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (1.1k citations), Electrical and Electronic Engineering (1.9k citations), Mechanics of Materials (271 citations), Hardware and Architecture (74 citations) and Atomic and Molecular Physics, and Optics (260 citations). D. Edelstein has collaborated with scholars based in United States, Israel and Germany. Frequent co-authors include R. Rosenberg, C.‐K. Hu, K. P. Rodbell, Joachim N. Burghartz, C.-C. Yang, K.A. Jenkins, M. Soyuer, G.A. Sai-Halasz, H. Ainspan and Y. J. Mii. Their work appears in journals such as IEEE Electron Device Letters, Journal of Applied Polymer Science, Applied Physics Letters, Journal of Applied Physics and Electrochemical and Solid-State Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.