Wei‐Tsu Tseng
Impact in
- Biomedical Engineering top 5%
- Advanced Surface Polishing Techniques
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- Copper Interconnects and Reliability
Papers in
-
- Semiconductor materials and devices 29
- Integrated Circuits and Semiconductor Failure Analysis 23
- Advanced Machining and Optimization Techniques 9
- Advancements in Photolithography Techniques 6
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- Advanced Surface Polishing Techniques 53
- Co-authors
- Ching‐Fa Yeh (2 shared papers)Bau‐Tong Dai (2 shared papers)Ming Feng (1 shared paper)A. Simon (4 shared papers)E. Liniger (4 shared papers)S. Kaldor (3 shared papers)D.L. Rath (3 shared papers)Ji Chul Yang (3 shared papers)
- Journals
- Thin Solid Films (12 papers)ECS Journal of Solid State Science and Technology (10 papers)Journal of The Electrochemical Society (8 papers)Materials Chemistry and Physics (3 papers)Journal of Applied Physics (3 papers)
- Partner nations
- United StatesTaiwanGermany
In The Last Decade
Wei‐Tsu Tseng
71 papers receiving 991 citations
Peers
Comparison fields: 5 of 50
- Biomedical Engineering 687
- Electronic, Optical and Magnetic Materials 281
- Electrical and Electronic Engineering 603
- Mechanical Engineering 379
- Materials Chemistry 345
Countries citing papers authored by Wei‐Tsu Tseng
This map shows the geographic impact of Wei‐Tsu Tseng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei‐Tsu Tseng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei‐Tsu Tseng more than expected).
Fields of papers citing papers by Wei‐Tsu Tseng
This network shows the impact of papers produced by Wei‐Tsu Tseng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei‐Tsu Tseng. The network helps show where Wei‐Tsu Tseng may publish in the future.
Co-authors
The 25 scholars most cited alongside Wei‐Tsu Tseng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 72 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 119 | |
| 2 | 2003 | 94 | |
| 3 | 1996 | 87 | |
| 4 | 1999 | 62 | |
| 5 | 1997 | 53 | |
| 6 | 2000 | 49 | |
| 7 | 2017 | 47 | |
| 8 | 2004 | 45 | |
| 9 | 1999 | 29 | |
| 10 | 2005 | 27 | |
| 11 | 1996 | 26 | |
| 12 | 1997 | 22 | |
| 13 | 2001 | 22 | |
| 14 | 1998 | 22 | |
| 15 | 2013 | 18 | |
| 16 | 1997 | 17 | |
| 17 | 2016 | 16 | |
| 18 | 2000 | 16 | |
| 19 | 2013 | 15 | |
| 20 | 2004 | 15 |
About Wei‐Tsu Tseng
Wei‐Tsu Tseng is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Materials Chemistry, having authored 72 papers that have together received 1.1k indexed citations. Recurring topics across this work include Advanced Surface Polishing Techniques (53 papers), Semiconductor materials and devices (29 papers), Copper Interconnects and Reliability (27 papers), Integrated Circuits and Semiconductor Failure Analysis (23 papers), Advanced machining processes and optimization (14 papers), Metal and Thin Film Mechanics (10 papers), Advanced Machining and Optimization Techniques (9 papers) and Advancements in Photolithography Techniques (6 papers). The work is most often cited by research in Biomedical Engineering (687 citations), Electronic, Optical and Magnetic Materials (281 citations), Electrical and Electronic Engineering (603 citations), Mechanical Engineering (379 citations) and Materials Chemistry (345 citations). Wei‐Tsu Tseng has collaborated with scholars based in United States, Taiwan and Germany. Frequent co-authors include Ching‐Fa Yeh, Bau‐Tong Dai, Ming Feng, A. Simon, E. Liniger, S. Kaldor, D.L. Rath, Ji Chul Yang, Shih-Chin Lee and Ying-Lang Wang. Their work appears in journals such as Thin Solid Films, ECS Journal of Solid State Science and Technology, Journal of The Electrochemical Society, Materials Chemistry and Physics and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.