C.‐K. Hu
Impact in
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- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
Papers in
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- Semiconductor materials and devices 29
- Electronic Packaging and Soldering Technologies 19
- Electrodeposition and Electroless Coatings 7
- Integrated Circuits and Semiconductor Failure Analysis 6
- Advancements in Photolithography Techniques 5
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- Copper Interconnects and Reliability 40
- Co-authors
- R. Rosenberg (10 shared papers)J. M. E. Harper (4 shared papers)D. Edelstein (4 shared papers)Lynne Gignac (9 shared papers)K. P. Rodbell (1 shared paper)I. C. Noyan (7 shared papers)E. Liniger (8 shared papers)Kenneth P. Rodbell (5 shared papers)
- Journals
- Applied Physics Letters (7 papers)Journal of Applied Physics (7 papers)Thin Solid Films (3 papers)IBM Journal of Research and Development (2 papers)IEEE Transactions on Device and Materials Reliability (2 papers)
- Partner nations
- United StatesChinaItaly
In The Last Decade
C.‐K. Hu
51 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 59
- Electronic, Optical and Magnetic Materials 2.1k
- Electrical and Electronic Engineering 2.3k
- Mechanics of Materials 547
- Structural Biology 20
- Atomic and Molecular Physics, and Optics 366
Countries citing papers authored by C.‐K. Hu
This map shows the geographic impact of C.‐K. Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.‐K. Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.‐K. Hu more than expected).
Fields of papers citing papers by C.‐K. Hu
This network shows the impact of papers produced by C.‐K. Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.‐K. Hu. The network helps show where C.‐K. Hu may publish in the future.
Co-authors
The 25 scholars most cited alongside C.‐K. Hu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 363 | |
| 2 | 1999 | 324 | |
| 3 | 1999 | 284 | |
| 4 | 1998 | 234 | |
| 5 | 1995 | 197 | |
| 6 | 2002 | 182 | |
| 7 | 1995 | 125 | |
| 8 | 1998 | 114 | |
| 9 | 1995 | 110 | |
| 10 | 2003 | 99 | |
| 11 | 2003 | 94 | |
| 12 | 2005 | 69 | |
| 13 | 2003 | 46 | |
| 14 | 2016 | 45 | |
| 15 | 2003 | 39 | |
| 16 | 2004 | 35 | |
| 17 | 1996 | 34 | |
| 18 | 2006 | 33 | |
| 19 | 2002 | 24 | |
| 20 | 1993 | 22 |
About C.‐K. Hu
C.‐K. Hu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 55 papers that have together received 2.7k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (29 papers), Electronic Packaging and Soldering Technologies (19 papers), Metal and Thin Film Mechanics (7 papers), Electrodeposition and Electroless Coatings (7 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Advancements in Photolithography Techniques (5 papers) and Semiconductor materials and interfaces (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (2.1k citations), Electrical and Electronic Engineering (2.3k citations), Mechanics of Materials (547 citations), Structural Biology (20 citations) and Atomic and Molecular Physics, and Optics (366 citations). C.‐K. Hu has collaborated with scholars based in United States, China and Italy. Frequent co-authors include R. Rosenberg, J. M. E. Harper, D. Edelstein, Lynne Gignac, K. P. Rodbell, I. C. Noyan, E. Liniger, Kenneth P. Rodbell, C. Cabral and P. C. Andricacos. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics, Thin Solid Films, IBM Journal of Research and Development and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.