John Knickerbocker
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Semiconductor Lasers and Optical Devices
- Photonic and Optical Devices
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 2%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 63
- Electronic Packaging and Soldering Technologies 39
- Semiconductor materials and devices 12
- Semiconductor Lasers and Optical Devices 11
- Photonic and Optical Devices 10
- Electromagnetic Compatibility and Noise Suppression 8
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- Advanced Surface Polishing Techniques 8
- Co-authors
- Cornelia Tsang (45 shared papers)Paul Andry (37 shared papers)R. Polastre (25 shared papers)S. L. Wright (21 shared papers)R. Horton (17 shared papers)B. Dang (18 shared papers)Bucknell C. Webb (17 shared papers)C.S. Patel (12 shared papers)
- Journals
- IBM Journal of Research and Development (9 papers)IEEE Journal of Solid-State Circuits (2 papers)IEEE Sensors Journal (1 paper)Journal of Electronic Packaging (1 paper)Journal of the American Ceramic Society (1 paper)
- Partner nations
- United StatesJapanSwitzerland
In The Last Decade
John Knickerbocker
87 papers receiving 2.6k citations
John Knickerbocker's Hit Papers
Peers
Comparison fields: 5 of 70
- Electrical and Electronic Engineering 2.4k
- Automotive Engineering 395
- Hardware and Architecture 146
- Biomedical Engineering 456
- Electronic, Optical and Magnetic Materials 179
Countries citing papers authored by John Knickerbocker
This map shows the geographic impact of John Knickerbocker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Knickerbocker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Knickerbocker more than expected).
Fields of papers citing papers by John Knickerbocker
This network shows the impact of papers produced by John Knickerbocker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Knickerbocker. The network helps show where John Knickerbocker may publish in the future.
Co-authors
The 25 scholars most cited alongside John Knickerbocker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 89 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 401 |
| 2 | 2015 | 217 | |
| 3 | 2005 | 200 | |
| 4 | 2008 | 185 | |
| 5 | 2006 | 152 | |
| 6 | 2008 | 126 | |
| 7 | 2012 | 86 | |
| 8 | 2011 | 80 | |
| 9 | 2006 | 73 | |
| 10 | 2007 | 70 | |
| 11 | 2010 | 53 | |
| 12 | 2012 | 52 | |
| 13 | 2008 | 51 | |
| 14 | 2011 | 42 | |
| 15 | 2008 | 39 | |
| 16 | 2010 | 36 | |
| 17 | 2006 | 36 | |
| 18 | 2018 | 34 | |
| 19 | 2010 | 33 | |
| 20 | 2008 | 32 |
About John Knickerbocker
John Knickerbocker is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics, having authored 89 papers that have together received 2.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (63 papers), Electronic Packaging and Soldering Technologies (39 papers), Semiconductor materials and devices (12 papers), Additive Manufacturing and 3D Printing Technologies (12 papers), Semiconductor Lasers and Optical Devices (11 papers), Photonic and Optical Devices (10 papers), Advanced Surface Polishing Techniques (8 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.4k citations), Automotive Engineering (395 citations), Hardware and Architecture (146 citations), Biomedical Engineering (456 citations) and Electronic, Optical and Magnetic Materials (179 citations). John Knickerbocker has collaborated with scholars based in United States, Japan and Switzerland. Frequent co-authors include Cornelia Tsang, Paul Andry, R. Polastre, S. L. Wright, R. Horton, B. Dang, Bucknell C. Webb, C.S. Patel, E. Sprogis and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Journal of Solid-State Circuits, IEEE Sensors Journal, Journal of Electronic Packaging and Journal of the American Ceramic Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.