W. Cote
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
Papers in
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- Integrated Circuits and Semiconductor Failure Analysis 7
- Semiconductor materials and devices 7
- 3D IC and TSV technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
- Electronic Packaging and Soldering Technologies 3
- VLSI and FPGA Design Techniques 2
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- VLSI and Analog Circuit Testing 5
- Co-authors
- R. Wachnik (2 shared papers)H. Rathore (2 shared papers)S. Luce (2 shared papers)Cyprian Uzoh (2 shared papers)D. Edelstein (3 shared papers)John Dukovic (2 shared papers)J. Heidenreich (2 shared papers)R. Goldblatt (2 shared papers)
- Journals
- IEEE Transactions on Semiconductor Manufacturing (1 paper)Thin Solid Films (1 paper)IBM Journal of Research and Development (1 paper)IEEE Journal of Solid-State Circuits (1 paper)
- Partner nations
- United StatesSwitzerland
In The Last Decade
W. Cote
14 papers receiving 415 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 193
- Electrical and Electronic Engineering 382
- Hardware and Architecture 33
- Biomedical Engineering 129
- Nuclear Energy and Engineering 1
Countries citing papers authored by W. Cote
This map shows the geographic impact of W. Cote's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Cote with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Cote more than expected).
Fields of papers citing papers by W. Cote
This network shows the impact of papers produced by W. Cote. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Cote. The network helps show where W. Cote may publish in the future.
Co-authors
The 25 scholars most cited alongside W. Cote, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 229 | |
| 2 | 1992 | 84 | |
| 3 | 2002 | 38 | |
| 4 | 1995 | 29 | |
| 5 | 1987 | 21 | |
| 6 | 1991 | 15 | |
| 7 | 2006 | 14 | |
| 8 | 2003 | 7 | |
| 9 | 2008 | 7 | |
| 10 | 2020 | 5 | |
| 11 | 2002 | 5 | |
| 12 | 2008 | 5 | |
| 13 | 2002 | 2 | |
| 14 | 2022 | 1 | |
| 15 | 2003 | 0 |
About W. Cote
W. Cote is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Computer Networks and Communications, having authored 15 papers that have together received 462 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (7 papers), Semiconductor materials and devices (7 papers), VLSI and Analog Circuit Testing (5 papers), Copper Interconnects and Reliability (5 papers), 3D IC and TSV technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and VLSI and FPGA Design Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (193 citations), Electrical and Electronic Engineering (382 citations), Hardware and Architecture (33 citations), Biomedical Engineering (129 citations) and Nuclear Energy and Engineering (1 citation). W. Cote has collaborated with scholars based in United States and Switzerland. Frequent co-authors include R. Wachnik, H. Rathore, S. Luce, Cyprian Uzoh, D. Edelstein, John Dukovic, J. Heidenreich, R. Goldblatt, A. Simon and T.L. McDevitt. Their work appears in journals such as IEEE Transactions on Semiconductor Manufacturing, Thin Solid Films, IBM Journal of Research and Development and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.