B. Agarwala

12 papers and 198 indexed citations i.

B. Agarwala has authored 12 papers that have received a total of 198 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Semiconductor materials and interfaces (4 papers). B. Agarwala is often cited by papers focused on Copper Interconnects and Reliability (8 papers), Electronic Packaging and Soldering Technologies (7 papers) and Semiconductor materials and interfaces (4 papers) and collaborates with scholars based in United States. B. Agarwala's co-authors include B.K. Patnaik, Paul S. Ho, M. J. Attardo, Jeffrey F. Roeder and Franz Faupel and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Thin Solid Films.