B. Agarwala
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 10
- Semiconductor materials and devices 6
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Copper Interconnects and Reliability 11
- Co-authors
- M. J. Attardo (1 shared paper)B.K. Patnaik (2 shared papers)H. Rathore (2 shared papers)R. Rosenberg (1 shared paper)C.‐K. Hu (1 shared paper)A. Simon (2 shared papers)D. Edelstein (2 shared papers)C. Cabral (1 shared paper)
- Journals
- Journal of Applied Physics (4 papers)Journal of Electronic Materials (1 paper)Journal of The Electrochemical Society (1 paper)Thin Solid Films (1 paper)Journal of Vacuum Science and Technology (1 paper)
- Partner nations
- United StatesSwitzerland
In The Last Decade
B. Agarwala
15 papers receiving 305 citations
Peers
Comparison fields: 5 of 23
- Electronic, Optical and Magnetic Materials 252
- Electrical and Electronic Engineering 305
- Mechanics of Materials 63
- Atomic and Molecular Physics, and Optics 57
- Hardware and Architecture 11
Countries citing papers authored by B. Agarwala
This map shows the geographic impact of B. Agarwala's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Agarwala with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Agarwala more than expected).
Fields of papers citing papers by B. Agarwala
This network shows the impact of papers produced by B. Agarwala. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Agarwala. The network helps show where B. Agarwala may publish in the future.
Co-authors
The 25 scholars most cited alongside B. Agarwala, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1970 | 98 | |
| 2 | 2001 | 63 | |
| 3 | 1972 | 38 | |
| 4 | 2003 | 33 | |
| 5 | 1995 | 28 | |
| 6 | 1985 | 23 | |
| 7 | 1974 | 16 | |
| 8 | 1976 | 13 | |
| 9 | 1972 | 10 | |
| 10 | 1975 | 5 | |
| 11 | 1968 | 3 | |
| 12 | 1990 | 2 | |
| 13 | 1975 | 2 | |
| 14 | 2005 | 2 | |
| 15 | 1990 | 1 |
About B. Agarwala
B. Agarwala is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanical Engineering and Mechanics of Materials, having authored 15 papers that have together received 337 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and devices (6 papers), Semiconductor materials and interfaces (4 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Advanced Welding Techniques Analysis (1 paper), Microstructure and Mechanical Properties of Steels (1 paper) and Metal and Thin Film Mechanics (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (252 citations), Electrical and Electronic Engineering (305 citations), Mechanics of Materials (63 citations), Atomic and Molecular Physics, and Optics (57 citations) and Hardware and Architecture (11 citations). B. Agarwala has collaborated with scholars based in United States and Switzerland. Frequent co-authors include M. J. Attardo, B.K. Patnaik, H. Rathore, R. Rosenberg, C.‐K. Hu, A. Simon, D. Edelstein, C. Cabral, S. G. Malhotra and Cyprian Uzoh. Their work appears in journals such as Journal of Applied Physics, Journal of Electronic Materials, Journal of The Electrochemical Society, Thin Solid Films and Journal of Vacuum Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.