A. Deutsch
Impact in
- Hardware and Architecture top 2%
- VLSI and Analog Circuit Testing
-
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
- 3D IC and TSV technologies
- VLSI and FPGA Design Techniques
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electrostatic Discharge in Electronics
Papers in
-
- Electromagnetic Compatibility and Noise Suppression 60
- 3D IC and TSV technologies 46
- Low-power high-performance VLSI design 21
- Microwave and Dielectric Measurement Techniques 17
- Electronic Packaging and Soldering Technologies 16
- VLSI and FPGA Design Techniques 11
- Advancements in PLL and VCO Technologies 9
-
- VLSI and Analog Circuit Testing 10
- Co-authors
- G.V. Kopcsay (44 shared papers)C.W. Surovic (38 shared papers)P.J. Restle (6 shared papers)P. Coteus (16 shared papers)B.J. Rubin (20 shared papers)H.H. Smith (12 shared papers)B. Krauter (10 shared papers)K.A. Jenkins (5 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (9 papers)IBM Journal of Research and Development (5 papers)IEEE Transactions on Magnetics (3 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2 papers)IEEE Journal of Solid-State Circuits (2 papers)
- Partner nations
- United StatesGermanyChina
In The Last Decade
A. Deutsch
85 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 50
- Hardware and Architecture 286
- Electrical and Electronic Engineering 1.9k
- Computer Networks and Communications 156
- Astronomy and Astrophysics 103
- Electronic, Optical and Magnetic Materials 97
Countries citing papers authored by A. Deutsch
This map shows the geographic impact of A. Deutsch's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Deutsch with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Deutsch more than expected).
Fields of papers citing papers by A. Deutsch
This network shows the impact of papers produced by A. Deutsch. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Deutsch. The network helps show where A. Deutsch may publish in the future.
Co-authors
The 25 scholars most cited alongside A. Deutsch, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 90 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 306 | |
| 2 | 2005 | 205 | |
| 3 | 1990 | 163 | |
| 4 | 2001 | 159 | |
| 5 | 1995 | 138 | |
| 6 | 1998 | 130 | |
| 7 | 2002 | 65 | |
| 8 | 1992 | 50 | |
| 9 | 2005 | 48 | |
| 10 | 1998 | 47 | |
| 11 | 2001 | 38 | |
| 12 | 2002 | 37 | |
| 13 | 1999 | 33 | |
| 14 | 1994 | 25 | |
| 15 | 2002 | 24 | |
| 16 | 2007 | 24 | |
| 17 | 1990 | 23 | |
| 18 | 2002 | 21 | |
| 19 | 2009 | 21 | |
| 20 | 2009 | 18 |
About A. Deutsch
A. Deutsch is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Electronic, Optical and Magnetic Materials and Materials Chemistry, having authored 90 papers that have together received 2.0k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (60 papers), 3D IC and TSV technologies (46 papers), Low-power high-performance VLSI design (21 papers), Microwave and Dielectric Measurement Techniques (17 papers), Electronic Packaging and Soldering Technologies (16 papers), VLSI and FPGA Design Techniques (11 papers), VLSI and Analog Circuit Testing (10 papers) and Advancements in PLL and VCO Technologies (9 papers). The work is most often cited by research in Hardware and Architecture (286 citations), Electrical and Electronic Engineering (1.9k citations), Computer Networks and Communications (156 citations), Astronomy and Astrophysics (103 citations) and Electronic, Optical and Magnetic Materials (97 citations). A. Deutsch has collaborated with scholars based in United States, Germany and China. Frequent co-authors include G.V. Kopcsay, C.W. Surovic, P.J. Restle, P. Coteus, B.J. Rubin, H.H. Smith, B. Krauter, K.A. Jenkins, Tom Gallo and G. Katopis. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Magnetics, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and IEEE Journal of Solid-State Circuits.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.