John Dukovic
Impact in
- Electrochemistry top 2%
- Electrochemical Analysis and Applications
-
- Copper Interconnects and Reliability
Papers in
-
- Electrodeposition and Electroless Coatings 11
- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 6
- Integrated Circuits and Semiconductor Failure Analysis 5
- Semiconductor materials and devices 3
-
- Anodic Oxide Films and Nanostructures 5
- Co-authors
- P. C. Andricacos (7 shared papers)Cyprian Uzoh (3 shared papers)Hariklia Deligianni (1 shared paper)Jean Horkans (1 shared paper)Charles W. Tobias (3 shared papers)L. T. Romankiw (4 shared papers)S. Mehdizadeh (4 shared papers)H. Y. Cheh (3 shared papers)
- Journals
- Journal of The Electrochemical Society (7 papers)IBM Journal of Research and Development (3 papers)The Electrochemical Society Interface (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)ECS Transactions (1 paper)
- Partner nations
- United StatesGermanyIsrael
In The Last Decade
John Dukovic
22 papers receiving 1.8k citations
John Dukovic's Hit Papers
Peers
Comparison fields: 5 of 63
- Electrochemistry 289
- Electronic, Optical and Magnetic Materials 623
- Electrical and Electronic Engineering 1.6k
- Metals and Alloys 40
- Materials Chemistry 686
Countries citing papers authored by John Dukovic
This map shows the geographic impact of John Dukovic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Dukovic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Dukovic more than expected).
Fields of papers citing papers by John Dukovic
This network shows the impact of papers produced by John Dukovic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Dukovic. The network helps show where John Dukovic may publish in the future.
Co-authors
The 25 scholars most cited alongside John Dukovic, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Damascene copper electroplating for chip interconnections Hit paper breakdown → | 1998 | 1016 |
| 2 | 2002 | 196 | |
| 3 | 1987 | 194 | |
| 4 | 1989 | 95 | |
| 5 | 1990 | 62 | |
| 6 | 1992 | 60 | |
| 7 | 2009 | 53 | |
| 8 | 1993 | 48 | |
| 9 | 1993 | 40 | |
| 10 | 1990 | 36 | |
| 11 | 1990 | 32 | |
| 12 | 1992 | 30 | |
| 13 | 2012 | 22 | |
| 14 | 2010 | 20 | |
| 15 | Electrochemical Microfabrication II | 1992 | 8 |
| 16 | 1998 | 3 | |
| 17 | 2004 | 3 | |
| 18 | 1991 | 3 | |
| 19 | 2002 | 3 | |
| 20 | 2008 | 2 |
About John Dukovic
John Dukovic is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials, Electrochemistry and Atomic and Molecular Physics, and Optics, having authored 22 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (11 papers), Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers), Anodic Oxide Films and Nanostructures (5 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Copper Interconnects and Reliability (5 papers), Electrochemical Analysis and Applications (4 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Electrochemistry (289 citations), Electronic, Optical and Magnetic Materials (623 citations), Electrical and Electronic Engineering (1.6k citations), Metals and Alloys (40 citations) and Materials Chemistry (686 citations). John Dukovic has collaborated with scholars based in United States, Germany and Israel. Frequent co-authors include P. C. Andricacos, Cyprian Uzoh, Hariklia Deligianni, Jean Horkans, Charles W. Tobias, L. T. Romankiw, S. Mehdizadeh, H. Y. Cheh, A. Simon and H. Rathore. Their work appears in journals such as Journal of The Electrochemical Society, IBM Journal of Research and Development, The Electrochemical Society Interface, IEEE Transactions on Device and Materials Reliability and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.