T. Nogami
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
Papers in
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- Copper Interconnects and Reliability 39
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- Semiconductor materials and devices 24
- Electronic Packaging and Soldering Technologies 15
- Electrodeposition and Electroless Coatings 9
- 3D IC and TSV technologies 6
- Co-authors
- D. Edelstein (11 shared papers)Changsup Ryu (2 shared papers)S.S. Wong (2 shared papers)Alvin L. S. Loke (2 shared papers)James J. Kelly (10 shared papers)Valery M. Dubin (2 shared papers)C.-C. Yang (4 shared papers)G.W. Ray (1 shared paper)
- Journals
- Journal of The Electrochemical Society (3 papers)Semiconductor Science and Technology (2 papers)Journal of Applied Physics (2 papers)IEEE Transactions on Electron Devices (2 papers)Hydrological Processes (2 papers)
- Partner nations
- United StatesJapanGermany
In The Last Decade
T. Nogami
49 papers receiving 695 citations
Peers
Comparison fields: 5 of 52
- Electronic, Optical and Magnetic Materials 439
- Electrical and Electronic Engineering 576
- Mechanics of Materials 129
- Atomic and Molecular Physics, and Optics 103
- Environmental Engineering 44
Countries citing papers authored by T. Nogami
This map shows the geographic impact of T. Nogami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Nogami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Nogami more than expected).
Fields of papers citing papers by T. Nogami
This network shows the impact of papers produced by T. Nogami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Nogami. The network helps show where T. Nogami may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Nogami, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 141 | |
| 2 | 2013 | 93 | |
| 3 | 2010 | 69 | |
| 4 | 2005 | 63 | |
| 5 | 2016 | 43 | |
| 6 | 2012 | 40 | |
| 7 | 2013 | 31 | |
| 8 | 2002 | 27 | |
| 9 | 2020 | 19 | |
| 10 | 2017 | 18 | |
| 11 | 2012 | 15 | |
| 12 | 2013 | 15 | |
| 13 | 1994 | 14 | |
| 14 | 2019 | 13 | |
| 15 | 2011 | 13 | |
| 16 | 2013 | 11 | |
| 17 | 2020 | 10 | |
| 18 | 2007 | 8 | |
| 19 | 2018 | 8 | |
| 20 | 2021 | 7 |
About T. Nogami
T. Nogami is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Ecology, Atomic and Molecular Physics, and Optics and Mechanical Engineering, having authored 52 papers that have together received 739 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (39 papers), Semiconductor materials and devices (24 papers), Electronic Packaging and Soldering Technologies (15 papers), Electrodeposition and Electroless Coatings (9 papers), 3D IC and TSV technologies (6 papers), Semiconductor materials and interfaces (5 papers), Hydrology and Sediment Transport Processes (4 papers) and Metal and Thin Film Mechanics (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (439 citations), Electrical and Electronic Engineering (576 citations), Mechanics of Materials (129 citations), Atomic and Molecular Physics, and Optics (103 citations) and Environmental Engineering (44 citations). T. Nogami has collaborated with scholars based in United States, Japan and Germany. Frequent co-authors include D. Edelstein, Changsup Ryu, S.S. Wong, Alvin L. S. Loke, James J. Kelly, Valery M. Dubin, C.-C. Yang, G.W. Ray, Kee-Won Kwon and T. Spooner. Their work appears in journals such as Journal of The Electrochemical Society, Semiconductor Science and Technology, Journal of Applied Physics, IEEE Transactions on Electron Devices and Hydrological Processes.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.