S. Molis
Impact in
- Ceramics and Composites top 10%
- Advanced ceramic materials synthesis
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- Copper Interconnects and Reliability
Papers in
-
- Semiconductor materials and devices 12
- Integrated Circuits and Semiconductor Failure Analysis 3
- 3D IC and TSV technologies 3
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- Copper Interconnects and Reliability 14
- Co-authors
- David R. Clarke (1 shared paper)Shaw Ling Hsu (3 shared papers)William J. MacKnight (2 shared papers)A. Grill (7 shared papers)E. Todd Ryan (5 shared papers)Defeng Shen (1 shared paper)Christos Dimitrakopoulos (2 shared papers)C. Feger (2 shared papers)
- Journals
- Journal of Applied Physics (3 papers)Microelectronic Engineering (2 papers)Applied Surface Science (1 paper)Polymer Engineering and Science (1 paper)Applied Physics Letters (1 paper)
- Partner nations
- United StatesSouth KoreaFrance
In The Last Decade
S. Molis
28 papers receiving 309 citations
Peers
Comparison fields: 5 of 49
- Ceramics and Composites 56
- Electronic, Optical and Magnetic Materials 105
- Mechanics of Materials 107
- Polymers and Plastics 54
- Electrical and Electronic Engineering 171
Countries citing papers authored by S. Molis
This map shows the geographic impact of S. Molis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Molis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Molis more than expected).
Fields of papers citing papers by S. Molis
This network shows the impact of papers produced by S. Molis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Molis. The network helps show where S. Molis may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Molis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1990 | 74 | |
| 2 | 2008 | 43 | |
| 3 | 2008 | 34 | |
| 4 | 2008 | 26 | |
| 5 | 1983 | 21 | |
| 6 | 1984 | 20 | |
| 7 | 1984 | 20 | |
| 8 | 2011 | 13 | |
| 9 | 1993 | 10 | |
| 10 | 2013 | 10 | |
| 11 | 1991 | 9 | |
| 12 | 1991 | 9 | |
| 13 | 2012 | 4 | |
| 14 | 1991 | 4 | |
| 15 | 2016 | 4 | |
| 16 | 2010 | 4 | |
| 17 | 2010 | 3 | |
| 18 | 1989 | 3 | |
| 19 | Post cleaning and defect reduction for tungsten chemical mechanical planarization | 2015 | 3 |
| 20 | 2012 | 2 |
About S. Molis
S. Molis is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Polymers and Plastics and Mechanical Engineering, having authored 29 papers that have together received 327 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (14 papers), Semiconductor materials and devices (12 papers), Synthesis and properties of polymers (6 papers), Metal and Thin Film Mechanics (5 papers), Advanced Surface Polishing Techniques (4 papers), Silicone and Siloxane Chemistry (4 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Ceramics and Composites (56 citations), Electronic, Optical and Magnetic Materials (105 citations), Mechanics of Materials (107 citations), Polymers and Plastics (54 citations) and Electrical and Electronic Engineering (171 citations). S. Molis has collaborated with scholars based in United States, South Korea and France. Frequent co-authors include David R. Clarke, Shaw Ling Hsu, William J. MacKnight, A. Grill, E. Todd Ryan, Defeng Shen, Christos Dimitrakopoulos, C. Feger, D. Edelstein and S. A. Cohen. Their work appears in journals such as Journal of Applied Physics, Microelectronic Engineering, Applied Surface Science, Polymer Engineering and Science and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.