S. Molis
Impact in
- Ceramics and Composites top 10%
- Advanced ceramic materials synthesis
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 20
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- Semiconductor materials and devices 16
- 3D IC and TSV technologies 5
- Co-authors
- David Robinson Clarke (1 shared paper)Shaw Ling Hsu (3 shared papers)William J. MacKnight (2 shared papers)A. Grill (5 shared papers)Christos D. Dimitrakopoulos (2 shared papers)C. Feger (2 shared papers)Defeng Shen (1 shared paper)E. Todd Ryan (4 shared papers)
- Journals
- Microelectronic Engineering (3 papers)Journal of Applied Physics (3 papers)Journal of the American Ceramic Society (1 paper)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)IEEE Electron Device Letters (1 paper)
- Partner nations
- United StatesFranceSouth Korea
In The Last Decade
S. Molis
33 papers receiving 389 citations
Peers
Comparison fields: 5 of 49
- Ceramics and Composites 64
- Electronic, Optical and Magnetic Materials 160
- Mechanics of Materials 133
- Electrical and Electronic Engineering 238
- Polymers and Plastics 57
Countries citing papers authored by S. Molis
This map shows the geographic impact of S. Molis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Molis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Molis more than expected).
Fields of papers citing papers by S. Molis
This network shows the impact of papers produced by S. Molis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Molis. The network helps show where S. Molis may publish in the future.
Co-authors
The 25 scholars most cited alongside S. Molis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1990 | 80 | |
| 2 | 2008 | 46 | |
| 3 | 2008 | 36 | |
| 4 | 2008 | 28 | |
| 5 | 1984 | 22 | |
| 6 | 1984 | 22 | |
| 7 | 1983 | 21 | |
| 8 | 2004 | 18 | |
| 9 | 2013 | 16 | |
| 10 | 2004 | 15 | |
| 11 | 2010 | 13 | |
| 12 | 2011 | 13 | |
| 13 | 1993 | 12 | |
| 14 | 1991 | 10 | |
| 15 | 1991 | 9 | |
| 16 | 2006 | 5 | |
| 17 | 2010 | 5 | |
| 18 | 2016 | 5 | |
| 19 | 2012 | 5 | |
| 20 | 2010 | 4 |
About S. Molis
S. Molis is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Polymers and Plastics, Mechanics of Materials and Ceramics and Composites, having authored 35 papers that have together received 414 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (16 papers), Synthesis and properties of polymers (6 papers), Metal and Thin Film Mechanics (6 papers), 3D IC and TSV technologies (5 papers), Advanced Surface Polishing Techniques (5 papers), Silicone and Siloxane Chemistry (4 papers) and Semiconductor materials and interfaces (3 papers). The work is most often cited by research in Ceramics and Composites (64 citations), Electronic, Optical and Magnetic Materials (160 citations), Mechanics of Materials (133 citations), Electrical and Electronic Engineering (238 citations) and Polymers and Plastics (57 citations). S. Molis has collaborated with scholars based in United States, France and South Korea. Frequent co-authors include David Robinson Clarke, Shaw Ling Hsu, William J. MacKnight, A. Grill, Christos D. Dimitrakopoulos, C. Feger, Defeng Shen, E. Todd Ryan, Daniel C. Edelstein and V. Patel. Their work appears in journals such as Microelectronic Engineering, Journal of Applied Physics, Journal of the American Ceramic Society, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.