Kris Vanstreels
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 52
- 3D IC and TSV technologies 26
- Electronic Packaging and Soldering Technologies 25
- Integrated Circuits and Semiconductor Failure Analysis 5
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- Copper Interconnects and Reliability 65
- Co-authors
- Mikhaı̈l R. Baklanov (29 shared papers)Patrick Verdonck (15 shared papers)Adam Urbanowicz (10 shared papers)Ingrid De Wolf (18 shared papers)Bart Vandevelde (10 shared papers)Eric Beyne (17 shared papers)Mario González (23 shared papers)Junwei Yang (1 shared paper)
- Journals
- Microelectronic Engineering (12 papers)Microelectronics Reliability (7 papers)Journal of Applied Physics (5 papers)Applied Physics Letters (4 papers)Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena (4 papers)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Kris Vanstreels
100 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 82
- Electronic, Optical and Magnetic Materials 729
- Electrical and Electronic Engineering 1.2k
- Ceramics and Composites 86
- Mechanics of Materials 355
- Inorganic Chemistry 187
Countries citing papers authored by Kris Vanstreels
This map shows the geographic impact of Kris Vanstreels's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kris Vanstreels with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kris Vanstreels more than expected).
Fields of papers citing papers by Kris Vanstreels
This network shows the impact of papers produced by Kris Vanstreels. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kris Vanstreels. The network helps show where Kris Vanstreels may publish in the future.
Co-authors
The 25 scholars most cited alongside Kris Vanstreels, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 105 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 236 | |
| 2 | 2014 | 197 | |
| 3 | 2011 | 116 | |
| 4 | 2010 | 91 | |
| 5 | 2010 | 76 | |
| 6 | 2011 | 69 | |
| 7 | 2013 | 49 | |
| 8 | 2009 | 49 | |
| 9 | 2017 | 46 | |
| 10 | 2016 | 46 | |
| 11 | 2015 | 45 | |
| 12 | 2012 | 44 | |
| 13 | 2022 | 40 | |
| 14 | 2010 | 38 | |
| 15 | 2014 | 36 | |
| 16 | 2011 | 35 | |
| 17 | 2012 | 27 | |
| 18 | 2014 | 26 | |
| 19 | 2014 | 26 | |
| 20 | 2023 | 24 |
About Kris Vanstreels
Kris Vanstreels is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Biomedical Engineering and Materials Chemistry, having authored 105 papers that have together received 1.9k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (65 papers), Semiconductor materials and devices (52 papers), Metal and Thin Film Mechanics (43 papers), 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (25 papers), Advanced Surface Polishing Techniques (14 papers), Advanced ceramic materials synthesis (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (729 citations), Electrical and Electronic Engineering (1.2k citations), Ceramics and Composites (86 citations), Mechanics of Materials (355 citations) and Inorganic Chemistry (187 citations). Kris Vanstreels has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Mikhaı̈l R. Baklanov, Patrick Verdonck, Adam Urbanowicz, Ingrid De Wolf, Bart Vandevelde, Eric Beyne, Mario González, Junwei Yang, Riet Labie and Eduardo Saiz. Their work appears in journals such as Microelectronic Engineering, Microelectronics Reliability, Journal of Applied Physics, Applied Physics Letters and Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.