Ingrid De Wolf
Impact in
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- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Biomedical Engineering top 0.5%
- Advanced Surface Polishing Techniques
Papers in
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- Semiconductor materials and devices 129
- Integrated Circuits and Semiconductor Failure Analysis 117
- 3D IC and TSV technologies 115
- Electronic Packaging and Soldering Technologies 92
- Advanced MEMS and NEMS Technologies 84
- Advancements in Semiconductor Devices and Circuit Design 47
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- Advanced Surface Polishing Techniques 53
- Co-authors
- W. Merlijn van Spengen (18 shared papers)H.E. Maes (28 shared papers)Robert Puers (25 shared papers)Eric Beyne (100 shared papers)Mario González (47 shared papers)Kristof Croes (70 shared papers)Stephen Jones (3 shared papers)Herman Oprins (49 shared papers)
- Journals
- Microelectronics Reliability (42 papers)Journal of Applied Physics (21 papers)IEEE Transactions on Electron Devices (16 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (14 papers)Journal of Micromechanics and Microengineering (11 papers)
- Partner nations
- BelgiumNetherlandsUnited States
In The Last Decade
Ingrid De Wolf
452 papers receiving 7.2k citations
Ingrid De Wolf's Hit Papers
Peers
Comparison fields: 5 of 116
- Electrical and Electronic Engineering 5.7k
- Biomedical Engineering 2.5k
- Atomic and Molecular Physics, and Optics 1.7k
- Structural Biology 55
- Electronic, Optical and Magnetic Materials 562
Countries citing papers authored by Ingrid De Wolf
This map shows the geographic impact of Ingrid De Wolf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ingrid De Wolf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ingrid De Wolf more than expected).
Fields of papers citing papers by Ingrid De Wolf
This network shows the impact of papers produced by Ingrid De Wolf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ingrid De Wolf. The network helps show where Ingrid De Wolf may publish in the future.
Co-authors
The 25 scholars most cited alongside Ingrid De Wolf, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 468 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits Hit paper breakdown → | 1996 | 806 |
| 2 | 1996 | 279 | |
| 3 | 2004 | 198 | |
| 4 | 2002 | 163 | |
| 5 | 1999 | 151 | |
| 6 | 2005 | 128 | |
| 7 | 1992 | 127 | |
| 8 | 2007 | 126 | |
| 9 | 2012 | 125 | |
| 10 | 2011 | 116 | |
| 11 | 1996 | 97 | |
| 12 | 2011 | 92 | |
| 13 | 2003 | 90 | |
| 14 | 2003 | 86 | |
| 15 | 2010 | 80 | |
| 16 | 2003 | 78 | |
| 17 | 2010 | 73 | |
| 18 | 2005 | 71 | |
| 19 | 2019 | 69 | |
| 20 | 2008 | 64 |
About Ingrid De Wolf
Ingrid De Wolf is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials and Mechanical Engineering, having authored 468 papers that have together received 7.4k indexed citations. Recurring topics across this work include Semiconductor materials and devices (129 papers), Integrated Circuits and Semiconductor Failure Analysis (117 papers), 3D IC and TSV technologies (115 papers), Electronic Packaging and Soldering Technologies (92 papers), Advanced MEMS and NEMS Technologies (84 papers), Copper Interconnects and Reliability (60 papers), Advanced Surface Polishing Techniques (53 papers) and Advancements in Semiconductor Devices and Circuit Design (47 papers). The work is most often cited by research in Electrical and Electronic Engineering (5.7k citations), Biomedical Engineering (2.5k citations), Atomic and Molecular Physics, and Optics (1.7k citations), Structural Biology (55 citations) and Electronic, Optical and Magnetic Materials (562 citations). Ingrid De Wolf has collaborated with scholars based in Belgium, Netherlands and United States. Frequent co-authors include W. Merlijn van Spengen, H.E. Maes, Robert Puers, Eric Beyne, Mario González, Kristof Croes, Stephen Jones, Herman Oprins, H.A.C. Tilmans and R. Mertens. Their work appears in journals such as Microelectronics Reliability, Journal of Applied Physics, IEEE Transactions on Electron Devices, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Micromechanics and Microengineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.