Riet Labie
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Silicon and Solar Cell Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Thin-Film Transistor Technologies
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 37
- 3D IC and TSV technologies 29
- Silicon and Solar Cell Technologies 16
- Thin-Film Transistor Technologies 8
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- Aluminum Alloys Composites Properties 8
- Co-authors
- Eric Beyne (15 shared papers)Wouter Ruythooren (4 shared papers)Bart Vandevelde (20 shared papers)Jan Van Humbeeck (1 shared paper)Ingrid De Wolf (11 shared papers)Bert Verlinden (10 shared papers)Paresh Limaye (9 shared papers)Chukwudi Okoro (4 shared papers)
- Journals
- Microelectronics Reliability (4 papers)Journal of Applied Physics (2 papers)IEEE Journal of Photovoltaics (2 papers)IEEE Transactions on Advanced Packaging (1 paper)International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) (1 paper)
- Partner nations
- BelgiumNetherlandsFrance
In The Last Decade
Riet Labie
56 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 1.1k
- Electronic, Optical and Magnetic Materials 189
- Mechanical Engineering 273
- Automotive Engineering 79
- Atomic and Molecular Physics, and Optics 152
Countries citing papers authored by Riet Labie
This map shows the geographic impact of Riet Labie's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Riet Labie with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Riet Labie more than expected).
Fields of papers citing papers by Riet Labie
This network shows the impact of papers produced by Riet Labie. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Riet Labie. The network helps show where Riet Labie may publish in the future.
Co-authors
The 25 scholars most cited alongside Riet Labie, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 58 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 119 | |
| 2 | 2011 | 116 | |
| 3 | 2010 | 89 | |
| 4 | 2010 | 87 | |
| 5 | 2011 | 69 | |
| 6 | 2008 | 66 | |
| 7 | 2010 | 51 | |
| 8 | 2012 | 43 | |
| 9 | 2010 | 40 | |
| 10 | 2012 | 35 | |
| 11 | 2008 | 32 | |
| 12 | 2012 | 30 | |
| 13 | 2011 | 25 | |
| 14 | 2007 | 22 | |
| 15 | 2008 | 21 | |
| 16 | 2010 | 20 | |
| 17 | 2010 | 17 | |
| 18 | 2010 | 17 | |
| 19 | 2011 | 16 | |
| 20 | 2005 | 15 |
About Riet Labie
Riet Labie is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Aerospace Engineering and Atomic and Molecular Physics, and Optics, having authored 58 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (29 papers), Silicon and Solar Cell Technologies (16 papers), Copper Interconnects and Reliability (9 papers), Aluminum Alloys Composites Properties (8 papers), Thin-Film Transistor Technologies (8 papers), Aluminum Alloy Microstructure Properties (7 papers) and Semiconductor materials and interfaces (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Electronic, Optical and Magnetic Materials (189 citations), Mechanical Engineering (273 citations), Automotive Engineering (79 citations) and Atomic and Molecular Physics, and Optics (152 citations). Riet Labie has collaborated with scholars based in Belgium, Netherlands and France. Frequent co-authors include Eric Beyne, Wouter Ruythooren, Bart Vandevelde, Jan Van Humbeeck, Ingrid De Wolf, Bert Verlinden, Paresh Limaye, Chukwudi Okoro, Kris Vanstreels and Dirk Vandepitte. Their work appears in journals such as Microelectronics Reliability, Journal of Applied Physics, IEEE Journal of Photovoltaics, IEEE Transactions on Advanced Packaging and International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.