Andy Miller
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 105
- Electronic Packaging and Soldering Technologies 74
- Advancements in Photolithography Techniques 23
- Semiconductor materials and devices 15
-
- Advanced Surface Polishing Techniques 24
- Nanofabrication and Lithography Techniques 21
- Co-authors
- Eric Beyne (114 shared papers)Gerald Beyer (70 shared papers)Alain Phommahaxay (36 shared papers)Lan Peng (22 shared papers)Joeri De Vos (31 shared papers)Soon-Wook Kim (9 shared papers)Kenneth June Rebibis (44 shared papers)N. Heylen (7 shared papers)
- Journals
- Microelectronic Engineering (3 papers)Journal of Photopolymer Science and Technology (2 papers)IEEE Transactions on Semiconductor Manufacturing (2 papers)Transactions of the IMF (1 paper)British Journal of Educational Psychology (1 paper)
- Partner nations
- BelgiumUnited StatesJapan
In The Last Decade
Andy Miller
134 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 86
- Electrical and Electronic Engineering 1.3k
- Automotive Engineering 182
- Electronic, Optical and Magnetic Materials 189
- Biomedical Engineering 379
- Ceramics and Composites 40
Countries citing papers authored by Andy Miller
This map shows the geographic impact of Andy Miller's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andy Miller with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andy Miller more than expected).
Fields of papers citing papers by Andy Miller
This network shows the impact of papers produced by Andy Miller. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andy Miller. The network helps show where Andy Miller may publish in the future.
Co-authors
The 25 scholars most cited alongside Andy Miller, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 146 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 115 | |
| 2 | 2020 | 84 | |
| 3 | 2000 | 66 | |
| 4 | 2019 | 61 | |
| 5 | 2016 | 51 | |
| 6 | 2020 | 44 | |
| 7 | 1981 | 42 | |
| 8 | 2018 | 38 | |
| 9 | 2021 | 35 | |
| 10 | 2017 | 33 | |
| 11 | 2015 | 32 | |
| 12 | 2012 | 31 | |
| 13 | 2009 | 30 | |
| 14 | 2018 | 28 | |
| 15 | 2023 | 24 | |
| 16 | 2016 | 24 | |
| 17 | 2018 | 23 | |
| 18 | 2019 | 22 | |
| 19 | 2014 | 20 | |
| 20 | 2013 | 20 |
About Andy Miller
Andy Miller is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials and Industrial and Manufacturing Engineering, having authored 146 papers that have together received 1.5k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (105 papers), Electronic Packaging and Soldering Technologies (74 papers), Additive Manufacturing and 3D Printing Technologies (25 papers), Advanced Surface Polishing Techniques (24 papers), Advancements in Photolithography Techniques (23 papers), Nanofabrication and Lithography Techniques (21 papers), Copper Interconnects and Reliability (16 papers) and Semiconductor materials and devices (15 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Automotive Engineering (182 citations), Electronic, Optical and Magnetic Materials (189 citations), Biomedical Engineering (379 citations) and Ceramics and Composites (40 citations). Andy Miller has collaborated with scholars based in Belgium, United States and Japan. Frequent co-authors include Eric Beyne, Gerald Beyer, Alain Phommahaxay, Lan Peng, Joeri De Vos, Soon-Wook Kim, Kenneth June Rebibis, N. Heylen, Serena Iacovo and Fumihiro Inoue. Their work appears in journals such as Microelectronic Engineering, Journal of Photopolymer Science and Technology, IEEE Transactions on Semiconductor Manufacturing, Transactions of the IMF and British Journal of Educational Psychology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.