Bart Vandevelde
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Biomedical Engineering top 5%
- Advanced Sensor and Energy Harvesting Materials
- Advanced Surface Polishing Techniques
Papers in
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- Electronic Packaging and Soldering Technologies 124
- 3D IC and TSV technologies 104
- Integrated Circuits and Semiconductor Failure Analysis 17
- Semiconductor materials and devices 12
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- Aluminum Alloys Composites Properties 14
- Co-authors
- Eric Beyne (81 shared papers)Mario González (40 shared papers)Jan Vanfleteren (13 shared papers)Fabrice Axisa (5 shared papers)Dirk Vandepitte (26 shared papers)Ingrid De Wolf (27 shared papers)Mathieu Vanden Bulcke (6 shared papers)Chukwudi Okoro (10 shared papers)
- Journals
- Microelectronics Reliability (17 papers)Journal of Electronic Packaging (3 papers)Microelectronic Engineering (3 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)IEEE Transactions on Device and Materials Reliability (2 papers)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Bart Vandevelde
176 papers receiving 2.6k citations
Peers
Comparison fields: 5 of 70
- Electrical and Electronic Engineering 2.1k
- Biomedical Engineering 812
- Automotive Engineering 222
- Mechanical Engineering 630
- Electronic, Optical and Magnetic Materials 253
Countries citing papers authored by Bart Vandevelde
This map shows the geographic impact of Bart Vandevelde's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bart Vandevelde with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bart Vandevelde more than expected).
Fields of papers citing papers by Bart Vandevelde
This network shows the impact of papers produced by Bart Vandevelde. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bart Vandevelde. The network helps show where Bart Vandevelde may publish in the future.
Co-authors
The 25 scholars most cited alongside Bart Vandevelde, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 180 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 344 | |
| 2 | 2011 | 116 | |
| 3 | 2006 | 93 | |
| 4 | 2010 | 91 | |
| 5 | 2007 | 91 | |
| 6 | 2011 | 69 | |
| 7 | 2008 | 64 | |
| 8 | 1998 | 64 | |
| 9 | 2009 | 57 | |
| 10 | 2004 | 49 | |
| 11 | 2013 | 48 | |
| 12 | 2007 | 45 | |
| 13 | 2004 | 44 | |
| 14 | 2004 | 42 | |
| 15 | 2010 | 40 | |
| 16 | 2003 | 34 | |
| 17 | 2009 | 30 | |
| 18 | 2012 | 30 | |
| 19 | 2008 | 30 | |
| 20 | 2012 | 30 |
About Bart Vandevelde
Bart Vandevelde is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Automotive Engineering, having authored 180 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (124 papers), 3D IC and TSV technologies (104 papers), Additive Manufacturing and 3D Printing Technologies (23 papers), Copper Interconnects and Reliability (21 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers), Aluminum Alloys Composites Properties (14 papers), Advanced Surface Polishing Techniques (13 papers) and Semiconductor materials and devices (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.1k citations), Biomedical Engineering (812 citations), Automotive Engineering (222 citations), Mechanical Engineering (630 citations) and Electronic, Optical and Magnetic Materials (253 citations). Bart Vandevelde has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Eric Beyne, Mario González, Jan Vanfleteren, Fabrice Axisa, Dirk Vandepitte, Ingrid De Wolf, Mathieu Vanden Bulcke, Chukwudi Okoro, Dominique Brosteaux and Riet Labie. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, Microelectronic Engineering, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.