Bart Vandevelde

66 papers and 1.3k indexed citations i.

Bart Vandevelde has authored 66 papers that have received a total of 1.3k indexed citations. This includes 59 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 14 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (45 papers), 3D IC and TSV technologies (33 papers) and Copper Interconnects and Reliability (9 papers). Bart Vandevelde is often cited by papers focused on Electronic Packaging and Soldering Technologies (45 papers), 3D IC and TSV technologies (33 papers) and Copper Interconnects and Reliability (9 papers) and collaborates with scholars based in Belgium, The Netherlands and United States. Bart Vandevelde's co-authors include Eric Beyne, Dirk Vandepitte, Mario González, Ingrid De Wolf and Vladimir Cherman and has published in prestigious journals such as Journal of Materials Science, Applied Physics A and Journal of Micromechanics and Microengineering.