Eric Beyne
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 0.5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 513
- Electronic Packaging and Soldering Technologies 346
- Semiconductor materials and devices 126
- Integrated Circuits and Semiconductor Failure Analysis 69
- Electromagnetic Compatibility and Noise Suppression 57
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- Additive Manufacturing and 3D Printing Technologies 88
- Co-authors
- Bart Vandevelde (82 shared papers)Gerald Beyer (159 shared papers)Ingrid De Wolf (102 shared papers)Bart Swinnen (49 shared papers)Geert Van der Plas (122 shared papers)W. De Raedt (55 shared papers)Vladimir O. Cherman (79 shared papers)Herman Oprins (57 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (21 papers)Microelectronics Reliability (17 papers)Microelectronic Engineering (13 papers)IEEE Transactions on Microwave Theory and Techniques (12 papers)Journal of Electronic Packaging (6 papers)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Eric Beyne
688 papers receiving 9.5k citations
Peers
Comparison fields: 5 of 88
- Electrical and Electronic Engineering 8.8k
- Automotive Engineering 1.1k
- Hardware and Architecture 434
- Electronic, Optical and Magnetic Materials 961
- Biomedical Engineering 1.8k
Countries citing papers authored by Eric Beyne
This map shows the geographic impact of Eric Beyne's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Beyne with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Beyne more than expected).
Fields of papers citing papers by Eric Beyne
This network shows the impact of papers produced by Eric Beyne. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Beyne. The network helps show where Eric Beyne may publish in the future.
Co-authors
The 25 scholars most cited alongside Eric Beyne, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 727 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 272 | |
| 2 | 2003 | 190 | |
| 3 | 2006 | 169 | |
| 4 | 2016 | 154 | |
| 5 | 2017 | 124 | |
| 6 | 2011 | 122 | |
| 7 | 2008 | 120 | |
| 8 | 2010 | 105 | |
| 9 | 2006 | 99 | |
| 10 | 2020 | 97 | |
| 11 | 1999 | 95 | |
| 12 | 2020 | 90 | |
| 13 | 2009 | 89 | |
| 14 | 2001 | 88 | |
| 15 | 2006 | 87 | |
| 16 | 2006 | 86 | |
| 17 | 2007 | 78 | |
| 18 | 2008 | 77 | |
| 19 | 2019 | 74 | |
| 20 | 2000 | 73 |
About Eric Beyne
Eric Beyne is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Mechanical Engineering, having authored 727 papers that have together received 9.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (513 papers), Electronic Packaging and Soldering Technologies (346 papers), Semiconductor materials and devices (126 papers), Additive Manufacturing and 3D Printing Technologies (88 papers), Copper Interconnects and Reliability (80 papers), Integrated Circuits and Semiconductor Failure Analysis (69 papers), Advanced Surface Polishing Techniques (65 papers) and Electromagnetic Compatibility and Noise Suppression (57 papers). The work is most often cited by research in Electrical and Electronic Engineering (8.8k citations), Automotive Engineering (1.1k citations), Hardware and Architecture (434 citations), Electronic, Optical and Magnetic Materials (961 citations) and Biomedical Engineering (1.8k citations). Eric Beyne has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Bart Vandevelde, Gerald Beyer, Ingrid De Wolf, Bart Swinnen, Geert Van der Plas, W. De Raedt, Vladimir O. Cherman, Herman Oprins, Andy Miller and S. Brebels. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Microelectronic Engineering, IEEE Transactions on Microwave Theory and Techniques and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.