Ivan Ciofi
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
Papers in
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- Copper Interconnects and Reliability 81
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- Semiconductor materials and devices 75
- Integrated Circuits and Semiconductor Failure Analysis 17
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 14
- Advancements in Photolithography Techniques 12
- Co-authors
- Zsolt Tökei (30 shared papers)Kristof Croes (38 shared papers)Mikhaı̈l R. Baklanov (13 shared papers)Zs. Tôkei (21 shared papers)Christopher J. Wilson (11 shared papers)Rogier Baert (9 shared papers)Olalla Varela Pedreira (14 shared papers)Jürgen Bömmels (17 shared papers)
- Journals
- IEEE Transactions on Electron Devices (8 papers)Microelectronic Engineering (6 papers)Journal of Applied Physics (4 papers)Japanese Journal of Applied Physics (3 papers)Microelectronics Reliability (2 papers)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Ivan Ciofi
95 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 47
- Electronic, Optical and Magnetic Materials 695
- Electrical and Electronic Engineering 1.1k
- Hardware and Architecture 49
- Mechanics of Materials 142
- Atomic and Molecular Physics, and Optics 171
Countries citing papers authored by Ivan Ciofi
This map shows the geographic impact of Ivan Ciofi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ciofi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ciofi more than expected).
Fields of papers citing papers by Ivan Ciofi
This network shows the impact of papers produced by Ivan Ciofi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ciofi. The network helps show where Ivan Ciofi may publish in the future.
Co-authors
The 25 scholars most cited alongside Ivan Ciofi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 100 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 117 | |
| 2 | 2016 | 104 | |
| 3 | 2008 | 73 | |
| 4 | 2018 | 71 | |
| 5 | 2017 | 55 | |
| 6 | 2018 | 51 | |
| 7 | 2019 | 47 | |
| 8 | 2018 | 46 | |
| 9 | 2015 | 45 | |
| 10 | 2010 | 44 | |
| 11 | 2012 | 44 | |
| 12 | 2018 | 37 | |
| 13 | 2014 | 35 | |
| 14 | 2013 | 23 | |
| 15 | 2012 | 21 | |
| 16 | 2018 | 20 | |
| 17 | 2020 | 20 | |
| 18 | 2016 | 19 | |
| 19 | 2017 | 18 | |
| 20 | 2023 | 16 |
About Ivan Ciofi
Ivan Ciofi is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Surfaces, Coatings and Films, having authored 100 papers that have together received 1.3k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (81 papers), Semiconductor materials and devices (75 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers), Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (14 papers), Semiconductor materials and interfaces (13 papers), Advancements in Photolithography Techniques (12 papers) and Metal and Thin Film Mechanics (12 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (695 citations), Electrical and Electronic Engineering (1.1k citations), Hardware and Architecture (49 citations), Mechanics of Materials (142 citations) and Atomic and Molecular Physics, and Optics (171 citations). Ivan Ciofi has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Zsolt Tökei, Kristof Croes, Mikhaı̈l R. Baklanov, Zs. Tôkei, Christopher J. Wilson, Rogier Baert, Olalla Varela Pedreira, Jürgen Bömmels, G. Groeseneken and Philippe J. Roussel. Their work appears in journals such as IEEE Transactions on Electron Devices, Microelectronic Engineering, Journal of Applied Physics, Japanese Journal of Applied Physics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.