Ivan Ciofi
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 67
- Electronic Packaging and Soldering Technologies 17
- Integrated Circuits and Semiconductor Failure Analysis 15
- 3D IC and TSV technologies 11
- Advancements in Semiconductor Devices and Circuit Design 10
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- Copper Interconnects and Reliability 74
- Co-authors
- Zsolt Tökei (30 shared papers)Kristof Croes (37 shared papers)Mikhaı̈l R. Baklanov (12 shared papers)Zs. Tôkei (21 shared papers)Christopher J. Wilson (11 shared papers)Rogier Baert (9 shared papers)Olalla Varela Pedreira (13 shared papers)G. Groeseneken (7 shared papers)
- Journals
- IEEE Transactions on Electron Devices (8 papers)Microelectronic Engineering (6 papers)Journal of Applied Physics (4 papers)Japanese Journal of Applied Physics (3 papers)Microelectronics Reliability (2 papers)
- Partner nations
- BelgiumUnited StatesSwitzerland
In The Last Decade
Ivan Ciofi
83 papers receiving 989 citations
Peers
Comparison fields: 5 of 43
- Electronic, Optical and Magnetic Materials 553
- Electrical and Electronic Engineering 885
- Hardware and Architecture 47
- Mechanics of Materials 118
- Atomic and Molecular Physics, and Optics 131
Countries citing papers authored by Ivan Ciofi
This map shows the geographic impact of Ivan Ciofi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ciofi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ciofi more than expected).
Fields of papers citing papers by Ivan Ciofi
This network shows the impact of papers produced by Ivan Ciofi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ciofi. The network helps show where Ivan Ciofi may publish in the future.
Co-authors
The 25 scholars most cited alongside Ivan Ciofi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 88 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 94 | |
| 2 | 2008 | 71 | |
| 3 | 2018 | 63 | |
| 4 | 2017 | 50 | |
| 5 | 2018 | 50 | |
| 6 | 2018 | 44 | |
| 7 | 2012 | 44 | |
| 8 | 2019 | 43 | |
| 9 | 2010 | 42 | |
| 10 | 2015 | 40 | |
| 11 | 2014 | 33 | |
| 12 | 2018 | 31 | |
| 13 | 2012 | 21 | |
| 14 | 2016 | 17 | |
| 15 | 2013 | 17 | |
| 16 | 2018 | 17 | |
| 17 | 2023 | 16 | |
| 18 | 2015 | 12 | |
| 19 | 2013 | 12 | |
| 20 | 2011 | 11 |
About Ivan Ciofi
Ivan Ciofi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Materials Chemistry, having authored 88 papers that have together received 1.0k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (74 papers), Semiconductor materials and devices (67 papers), Electronic Packaging and Soldering Technologies (17 papers), Integrated Circuits and Semiconductor Failure Analysis (15 papers), Metal and Thin Film Mechanics (11 papers), 3D IC and TSV technologies (11 papers), Semiconductor materials and interfaces (10 papers) and Advancements in Semiconductor Devices and Circuit Design (10 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (553 citations), Electrical and Electronic Engineering (885 citations), Hardware and Architecture (47 citations), Mechanics of Materials (118 citations) and Atomic and Molecular Physics, and Optics (131 citations). Ivan Ciofi has collaborated with scholars based in Belgium, United States and Switzerland. Frequent co-authors include Zsolt Tökei, Kristof Croes, Mikhaı̈l R. Baklanov, Zs. Tôkei, Christopher J. Wilson, Rogier Baert, Olalla Varela Pedreira, G. Groeseneken, J. Bömmels and Philippe Roussel. Their work appears in journals such as IEEE Transactions on Electron Devices, Microelectronic Engineering, Journal of Applied Physics, Japanese Journal of Applied Physics and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.