J. Bömmels
Impact in
-
- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- 3D IC and TSV technologies
Papers in
-
- Semiconductor materials and devices 38
- Electronic Packaging and Soldering Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 10
- 3D IC and TSV technologies 8
- Advancements in Photolithography Techniques 5
-
- Copper Interconnects and Reliability 40
- Co-authors
- Zsolt Tökei (24 shared papers)Kristof Croes (32 shared papers)Christoph Adelmann (10 shared papers)Christopher J. Wilson (12 shared papers)Zs. Tôkei (21 shared papers)H. Hotop (8 shared papers)Anshul Gupta (6 shared papers)Shreya Kundu (5 shared papers)
- Journals
- Microelectronic Engineering (5 papers)Microelectronics Reliability (4 papers)Journal of Applied Physics (3 papers)Review of Scientific Instruments (2 papers)IEEE Electron Device Letters (2 papers)
- Partner nations
- BelgiumGermanyUnited States
In The Last Decade
J. Bömmels
58 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 43
- Electronic, Optical and Magnetic Materials 501
- Electrical and Electronic Engineering 848
- Atomic and Molecular Physics, and Optics 318
- Surfaces, Coatings and Films 61
- Radiation 53
Countries citing papers authored by J. Bömmels
This map shows the geographic impact of J. Bömmels's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Bömmels with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Bömmels more than expected).
Fields of papers citing papers by J. Bömmels
This network shows the impact of papers produced by J. Bömmels. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Bömmels. The network helps show where J. Bömmels may publish in the future.
Co-authors
The 25 scholars most cited alongside J. Bömmels, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 58 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 73 | |
| 2 | 2014 | 72 | |
| 3 | 2018 | 64 | |
| 4 | 2017 | 63 | |
| 5 | 2003 | 51 | |
| 6 | 2016 | 46 | |
| 7 | 2015 | 45 | |
| 8 | 2018 | 45 | |
| 9 | 2013 | 32 | |
| 10 | 2000 | 32 | |
| 11 | 2013 | 31 | |
| 12 | 2017 | 28 | |
| 13 | 2015 | 28 | |
| 14 | 1999 | 26 | |
| 15 | 2014 | 24 | |
| 16 | 2018 | 24 | |
| 17 | 2005 | 24 | |
| 18 | 2014 | 23 | |
| 19 | 2016 | 22 | |
| 20 | 2016 | 19 |
About J. Bömmels
J. Bömmels is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanics of Materials and Surfaces, Coatings and Films, having authored 58 papers that have together received 1.1k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (40 papers), Semiconductor materials and devices (38 papers), Semiconductor materials and interfaces (11 papers), Electronic Packaging and Soldering Technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers), 3D IC and TSV technologies (8 papers), Atomic and Molecular Physics (7 papers) and Advancements in Photolithography Techniques (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (501 citations), Electrical and Electronic Engineering (848 citations), Atomic and Molecular Physics, and Optics (318 citations), Surfaces, Coatings and Films (61 citations) and Radiation (53 citations). J. Bömmels has collaborated with scholars based in Belgium, Germany and United States. Frequent co-authors include Zsolt Tökei, Kristof Croes, Christoph Adelmann, Christopher J. Wilson, Zs. Tôkei, H. Hotop, Anshul Gupta, Shreya Kundu, M.‐W. Ruf and Shibesh Dutta. Their work appears in journals such as Microelectronic Engineering, Microelectronics Reliability, Journal of Applied Physics, Review of Scientific Instruments and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.