Gerard McVicker
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
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- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
Papers in
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- Heat Transfer and Optimization 7
- Heat Transfer and Boiling Studies 7
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- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 4
- VLSI and FPGA Design Techniques 2
- Advanced Optical Network Technologies 1
- Semiconductor Lasers and Optical Devices 1
- Co-authors
- Sri M. Sri-Jayantha (5 shared papers)John Knickerbocker (5 shared papers)K. Bernstein (1 shared paper)R. Polastre (3 shared papers)S. L. Wright (3 shared papers)Cornelia Tsang (3 shared papers)Paul Andry (2 shared papers)Bucknell C. Webb (2 shared papers)
- Journals
- IBM Journal of Research and Development (2 papers)Japanese Journal of Applied Physics (1 paper)Robotica (1 paper)Journal of Microelectronics and Electronic Packaging (1 paper)
- Partner nations
- United StatesSwitzerlandJapan
In The Last Decade
Gerard McVicker
14 papers receiving 402 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 290
- Mechanical Engineering 122
- Automotive Engineering 32
- Hardware and Architecture 16
- Biomedical Engineering 82
Countries citing papers authored by Gerard McVicker
This map shows the geographic impact of Gerard McVicker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Gerard McVicker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Gerard McVicker more than expected).
Fields of papers citing papers by Gerard McVicker
This network shows the impact of papers produced by Gerard McVicker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Gerard McVicker. The network helps show where Gerard McVicker may publish in the future.
Co-authors
The 25 scholars most cited alongside Gerard McVicker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 199 | |
| 2 | 2008 | 51 | |
| 3 | 1996 | 32 | |
| 4 | 2005 | 29 | |
| 5 | 2017 | 21 | |
| 6 | 2006 | 20 | |
| 7 | 2016 | 17 | |
| 8 | 2017 | 14 | |
| 9 | 2003 | 13 | |
| 10 | 2017 | 10 | |
| 11 | 2008 | 7 | |
| 12 | 2012 | 5 | |
| 13 | 2018 | 3 | |
| 14 | 2016 | 2 | |
| 15 | 2014 | 0 |
About Gerard McVicker
Gerard McVicker is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Computational Mechanics, Biomedical Engineering and Surgery, having authored 15 papers that have together received 423 indexed citations. Recurring topics across this work include Heat Transfer and Optimization (7 papers), Heat Transfer and Boiling Studies (7 papers), Fluid Dynamics and Thin Films (5 papers), 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers), VLSI and FPGA Design Techniques (2 papers), Advanced Optical Network Technologies (1 paper) and Semiconductor Lasers and Optical Devices (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (290 citations), Mechanical Engineering (122 citations), Automotive Engineering (32 citations), Hardware and Architecture (16 citations) and Biomedical Engineering (82 citations). Gerard McVicker has collaborated with scholars based in United States, Switzerland and Japan. Frequent co-authors include Sri M. Sri-Jayantha, John Knickerbocker, K. Bernstein, R. Polastre, S. L. Wright, Cornelia Tsang, Paul Andry, Bucknell C. Webb, C.S. Patel and L.P. Buchwalter. Their work appears in journals such as IBM Journal of Research and Development, Japanese Journal of Applied Physics, Robotica and Journal of Microelectronics and Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.