H. Gan
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- 3D IC and TSV technologies 10
- Electronic Packaging and Soldering Technologies 9
- Semiconductor Lasers and Optical Devices 4
- Electrical and Thermal Properties of Materials 2
- VLSI and FPGA Design Techniques 1
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- Copper Interconnects and Reliability 4
- Co-authors
- K. N. Tu (4 shared papers)S. L. Wright (4 shared papers)John Knickerbocker (4 shared papers)R. Horton (4 shared papers)Cornelia Tsang (4 shared papers)R. Polastre (4 shared papers)L.P. Buchwalter (4 shared papers)Paul Andry (4 shared papers)
- Journals
- Journal of Electronic Materials (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Beilstein Journal of Nanotechnology (1 paper)JOM (1 paper)Journal of Applied Physics (1 paper)
- Partner nations
- United StatesChinaItaly
In The Last Decade
H. Gan
15 papers receiving 608 citations
Peers
Comparison fields: 5 of 36
- Electronic, Optical and Magnetic Materials 205
- Electrical and Electronic Engineering 595
- General Materials Science 19
- Mechanical Engineering 123
- Hardware and Architecture 21
Countries citing papers authored by H. Gan
This map shows the geographic impact of H. Gan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Gan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Gan more than expected).
Fields of papers citing papers by H. Gan
This network shows the impact of papers produced by H. Gan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Gan. The network helps show where H. Gan may publish in the future.
Co-authors
The 25 scholars most cited alongside H. Gan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 229 | |
| 2 | 2006 | 154 | |
| 3 | 2006 | 73 | |
| 4 | 2002 | 58 | |
| 5 | 2006 | 37 | |
| 6 | 2003 | 27 | |
| 7 | 2006 | 20 | |
| 8 | 2005 | 7 | |
| 9 | 2003 | 4 | |
| 10 | 2004 | 4 | |
| 11 | 2012 | 4 | |
| 12 | 2021 | 4 | |
| 13 | 2021 | 2 | |
| 14 | 2012 | 2 | |
| 15 | 2010 | 1 |
About H. Gan
H. Gan is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Mechanical Engineering and Mechanics of Materials, having authored 15 papers that have together received 626 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (9 papers), Semiconductor Lasers and Optical Devices (4 papers), Copper Interconnects and Reliability (4 papers), Semiconductor materials and interfaces (2 papers), Electrical and Thermal Properties of Materials (2 papers), VLSI and FPGA Design Techniques (1 paper) and Polymer crystallization and properties (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (205 citations), Electrical and Electronic Engineering (595 citations), General Materials Science (19 citations), Mechanical Engineering (123 citations) and Hardware and Architecture (21 citations). H. Gan has collaborated with scholars based in United States, China and Italy. Frequent co-authors include K. N. Tu, S. L. Wright, John Knickerbocker, R. Horton, Cornelia Tsang, R. Polastre, L.P. Buchwalter, Paul Andry, E. Sprogis and Ge Xu. Their work appears in journals such as Journal of Electronic Materials, IEEE Journal of Solid-State Circuits, Beilstein Journal of Nanotechnology, JOM and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.