Bucknell C. Webb
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 20
- Electronic Packaging and Soldering Technologies 14
- Semiconductor materials and devices 12
- Advanced DC-DC Converters 4
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- Magnetic properties of thin films 11
- Co-authors
- Paul Andry (15 shared papers)Cornelia Tsang (14 shared papers)S. L. Wright (12 shared papers)B. Dang (10 shared papers)John Knickerbocker (17 shared papers)E. Sprogis (9 shared papers)R. Polastre (10 shared papers)R. Horton (9 shared papers)
- Journals
- IEEE Transactions on Magnetics (8 papers)IBM Journal of Research and Development (5 papers)Journal of Applied Physics (5 papers)Solid State Communications (1 paper)AIAA Journal (1 paper)
- Partner nations
- United StatesJapanUnited Kingdom
In The Last Decade
Bucknell C. Webb
50 papers receiving 1.9k citations
Bucknell C. Webb's Hit Papers
Peers
Comparison fields: 5 of 63
- Electrical and Electronic Engineering 1.7k
- Automotive Engineering 277
- Electronic, Optical and Magnetic Materials 269
- Hardware and Architecture 104
- Atomic and Molecular Physics, and Optics 301
Countries citing papers authored by Bucknell C. Webb
This map shows the geographic impact of Bucknell C. Webb's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bucknell C. Webb with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bucknell C. Webb more than expected).
Fields of papers citing papers by Bucknell C. Webb
This network shows the impact of papers produced by Bucknell C. Webb. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bucknell C. Webb. The network helps show where Bucknell C. Webb may publish in the future.
Co-authors
The 25 scholars most cited alongside Bucknell C. Webb, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 419 |
| 2 | 2005 | 205 | |
| 3 | 2008 | 191 | |
| 4 | 2012 | 145 | |
| 5 | 2008 | 134 | |
| 6 | 2008 | 100 | |
| 7 | 2012 | 86 | |
| 8 | 2006 | 74 | |
| 9 | 2007 | 70 | |
| 10 | 1991 | 50 | |
| 11 | 2008 | 43 | |
| 12 | 2012 | 42 | |
| 13 | 1991 | 37 | |
| 14 | 2008 | 34 | |
| 15 | 2012 | 31 | |
| 16 | 1987 | 30 | |
| 17 | 1985 | 29 | |
| 18 | 1988 | 27 | |
| 19 | 2006 | 24 | |
| 20 | 1988 | 24 |
About Bucknell C. Webb
Bucknell C. Webb is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Biomedical Engineering, having authored 52 papers that have together received 2.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), Electronic Packaging and Soldering Technologies (14 papers), Semiconductor materials and devices (12 papers), Magnetic properties of thin films (11 papers), Magnetic Properties and Applications (10 papers), Analytical Chemistry and Sensors (4 papers), Advanced DC-DC Converters (4 papers) and Advanced Sensor and Energy Harvesting Materials (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (277 citations), Electronic, Optical and Magnetic Materials (269 citations), Hardware and Architecture (104 citations) and Atomic and Molecular Physics, and Optics (301 citations). Bucknell C. Webb has collaborated with scholars based in United States, Japan and United Kingdom. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, B. Dang, John Knickerbocker, E. Sprogis, R. Polastre, R. Horton, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IEEE Transactions on Magnetics, IBM Journal of Research and Development, Journal of Applied Physics, Solid State Communications and AIAA Journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.