M. J. Interrante
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 7
- Electronic Packaging and Soldering Technologies 4
- Semiconductor materials and devices 2
- Electrical and Thermal Properties of Materials 1
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- Additive Manufacturing and 3D Printing Technologies 2
- Co-authors
- Katsuyuki Sakuma (4 shared papers)John U. Knickerbocker (4 shared papers)B. Dang (3 shared papers)Chirag S. Patel (2 shared papers)Robert J. Polastre (2 shared papers)S. L. Wright (2 shared papers)Paul S. Andry (3 shared papers)Bucknell C. Webb (2 shared papers)
- Partner nations
- United StatesCanadaJapan
In The Last Decade
M. J. Interrante
7 papers receiving 506 citations
M. J. Interrante's Hit Papers
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 501
- Automotive Engineering 81
- Hardware and Architecture 28
- Electronic, Optical and Magnetic Materials 58
- Biomedical Engineering 76
Countries citing papers authored by M. J. Interrante
This map shows the geographic impact of M. J. Interrante's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Interrante with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Interrante more than expected).
Fields of papers citing papers by M. J. Interrante
This network shows the impact of papers produced by M. J. Interrante. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Interrante. The network helps show where M. J. Interrante may publish in the future.
Co-authors
The 25 scholars most cited alongside M. J. Interrante, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 424 |
| 2 | 2008 | 42 | |
| 3 | 2015 | 28 | |
| 4 | 2004 | 12 | |
| 5 | 2013 | 11 | |
| 6 | 2009 | 8 | |
| 7 | 2002 | 3 |
About M. J. Interrante
M. J. Interrante is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Ceramics and Composites, Industrial and Manufacturing Engineering and Atomic and Molecular Physics, and Optics, having authored 7 papers that have together received 528 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers), Semiconductor materials and devices (2 papers), Additive Manufacturing and 3D Printing Technologies (2 papers), Electrical and Thermal Properties of Materials (1 paper), Advanced ceramic materials synthesis (1 paper), Manufacturing Process and Optimization (1 paper) and Semiconductor materials and interfaces (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (501 citations), Automotive Engineering (81 citations), Hardware and Architecture (28 citations), Electronic, Optical and Magnetic Materials (58 citations) and Biomedical Engineering (76 citations). M. J. Interrante has collaborated with scholars based in United States, Canada and Japan. Frequent co-authors include Katsuyuki Sakuma, John U. Knickerbocker, B. Dang, Chirag S. Patel, Robert J. Polastre, S. L. Wright, Paul S. Andry, Bucknell C. Webb, Edmund J. Sprogis and Cornelia K. Tsang. Their work appears in journals such as IBM Journal of Research and Development.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.