B. Dang
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- 3D IC and TSV technologies 25
- Electronic Packaging and Soldering Technologies 17
- Semiconductor materials and devices 6
- Electrical and Thermal Properties of Materials 5
- Integrated Circuits and Semiconductor Failure Analysis 3
-
- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- Paul Andry (17 shared papers)Cornelia Tsang (14 shared papers)S. L. Wright (14 shared papers)Bucknell C. Webb (10 shared papers)John Knickerbocker (18 shared papers)R. Polastre (14 shared papers)R. Horton (8 shared papers)E. Sprogis (8 shared papers)
- Journals
- IBM Journal of Research and Development (5 papers)IEEE Electron Device Letters (2 papers)Journal of Microelectromechanical Systems (1 paper)Oxidation of Metals (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- United StatesJapanVietnam
In The Last Decade
B. Dang
29 papers receiving 1.5k citations
B. Dang's Hit Papers
Peers
Comparison fields: 5 of 57
- Electrical and Electronic Engineering 1.4k
- Automotive Engineering 261
- Hardware and Architecture 86
- Electronic, Optical and Magnetic Materials 123
- Biomedical Engineering 240
Countries citing papers authored by B. Dang
This map shows the geographic impact of B. Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Dang more than expected).
Fields of papers citing papers by B. Dang
This network shows the impact of papers produced by B. Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Dang. The network helps show where B. Dang may publish in the future.
Co-authors
The 25 scholars most cited alongside B. Dang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Three-dimensional silicon integration Hit paper breakdown → | 2008 | 419 |
| 2 | 2005 | 205 | |
| 3 | 2008 | 191 | |
| 4 | 2008 | 134 | |
| 5 | 2008 | 100 | |
| 6 | 2012 | 86 | |
| 7 | 2007 | 70 | |
| 8 | 2006 | 51 | |
| 9 | 2018 | 46 | |
| 10 | 2008 | 43 | |
| 11 | 2008 | 34 | |
| 12 | 2011 | 28 | |
| 13 | 2006 | 21 | |
| 14 | 2014 | 20 | |
| 15 | 2012 | 20 | |
| 16 | 2005 | 17 | |
| 17 | 2012 | 16 | |
| 18 | 2007 | 14 | |
| 19 | 2001 | 13 | |
| 20 | 2009 | 8 |
About B. Dang
B. Dang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanical Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics, having authored 29 papers that have together received 1.6k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (17 papers), Semiconductor materials and devices (6 papers), Electrical and Thermal Properties of Materials (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Semiconductor materials and interfaces (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advanced Surface Polishing Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Automotive Engineering (261 citations), Hardware and Architecture (86 citations), Electronic, Optical and Magnetic Materials (123 citations) and Biomedical Engineering (240 citations). B. Dang has collaborated with scholars based in United States, Japan and Vietnam. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, Bucknell C. Webb, John Knickerbocker, R. Polastre, R. Horton, E. Sprogis, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Electron Device Letters, Journal of Microelectromechanical Systems, Oxidation of Metals and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.