Bongsub Lee
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Chalcogenide Semiconductor Thin Films
- Advanced Memory and Neural Computing
Papers in
-
- 3D IC and TSV technologies 19
- Electronic Packaging and Soldering Technologies 16
- Chalcogenide Semiconductor Thin Films 4
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- Laura Mirkarimi (18 shared papers)Guilian Gao (19 shared papers)G. G. Fountain (17 shared papers)Jeremy Theil (12 shared papers)Cyprian Uzoh (15 shared papers)P. Mrozek (7 shared papers)Dominik Suwito (10 shared papers)S. G. Bishop (2 shared papers)
- Journals
- Journal of Applied Physics (1 paper)Engineering Fracture Mechanics (1 paper)ChemPhysChem (1 paper)IOP Conference Series Materials Science and Engineering (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (3 papers)
- Partner nations
- United StatesGermanySouth Korea
In The Last Decade
Bongsub Lee
27 papers receiving 355 citations
Peers
Comparison fields: 5 of 30
- Automotive Engineering 85
- Electrical and Electronic Engineering 386
- Electronic, Optical and Magnetic Materials 68
- Ceramics and Composites 15
- Structural Biology 3
Countries citing papers authored by Bongsub Lee
This map shows the geographic impact of Bongsub Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bongsub Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bongsub Lee more than expected).
Fields of papers citing papers by Bongsub Lee
This network shows the impact of papers produced by Bongsub Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bongsub Lee. The network helps show where Bongsub Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Bongsub Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 62 | |
| 2 | 2019 | 58 | |
| 3 | 2020 | 36 | |
| 4 | 2018 | 30 | |
| 5 | 2018 | 29 | |
| 6 | 2022 | 29 | |
| 7 | 2019 | 25 | |
| 8 | 2021 | 21 | |
| 9 | 2020 | 16 | |
| 10 | 2019 | 15 | |
| 11 | 2021 | 14 | |
| 12 | 2022 | 14 | |
| 13 | 2010 | 12 | |
| 14 | 2022 | 12 | |
| 15 | 2009 | 11 | |
| 16 | 2017 | 10 | |
| 17 | 2023 | 10 | |
| 18 | 2014 | 4 | |
| 19 | 2024 | 4 | |
| 20 | 2020 | 3 |
About Bongsub Lee
Bongsub Lee is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Mechanical Engineering and Materials Chemistry, having authored 28 papers that have together received 426 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (16 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Chalcogenide Semiconductor Thin Films (4 papers), Phase-change materials and chalcogenides (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Nanofabrication and Lithography Techniques (3 papers) and Advanced Surface Polishing Techniques (3 papers). The work is most often cited by research in Automotive Engineering (85 citations), Electrical and Electronic Engineering (386 citations), Electronic, Optical and Magnetic Materials (68 citations), Ceramics and Composites (15 citations) and Structural Biology (3 citations). Bongsub Lee has collaborated with scholars based in United States, Germany and South Korea. Frequent co-authors include Laura Mirkarimi, Guilian Gao, G. G. Fountain, Jeremy Theil, Cyprian Uzoh, P. Mrozek, Dominik Suwito, S. G. Bishop, Michael Huynh and Ping Liu. Their work appears in journals such as Journal of Applied Physics, Engineering Fracture Mechanics, ChemPhysChem, IOP Conference Series Materials Science and Engineering and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.