Bart Swinnen

4.0k citations

121 papers · 2.6k · 1 hit paper · h-index 29

Impact in

Neurology top 2%
- Amyotrophic Lateral Sclerosis Research
- Parkinson's Disease Mechanisms and Treatments
Genetics top 2%
- Neurogenetic and Muscular Disorders Research

Papers in

Electrical and Electronic Engineering 67
- 3D IC and TSV technologies 61
- Electronic Packaging and Soldering Technologies 36
- Semiconductor materials and devices 13
Neurology 28
- Neurological disorders and treatments 19
- Parkinson's Disease Mechanisms and Treatments 15

Co-authors: Wim Robberecht (3 shared papers)Eric Beyne (47 shared papers)Ludo Van Den Bosch (5 shared papers)Serguei Stoukatch (4 shared papers)Anne Jourdain (17 shared papers)Wouter Ruythooren (10 shared papers)Deniz Sabuncuoglu Tezcan (11 shared papers)Piet De Moor (13 shared papers)
Journals: Journal of Magnetism and Magnetic Materials (7 papers)Movement Disorders (3 papers)Physical review. B, Condensed matter (3 papers)Neuromodulation Technology at the Neural Interface (3 papers)Acta Neuropathologica (3 papers)
Partner nations: Belgium Netherlands United States

In The Last Decade

Bart Swinnen

114 papers receiving 2.5k citations

Bart Swinnen's Hit Papers

align trajectories log scale

The phenotypic variability of amyotrophic lateral sclerosis 2014 · 428 citations

Peers

Countries citing papers authored by Bart Swinnen

Since Specialization

Citations

This map shows the geographic impact of Bart Swinnen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bart Swinnen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bart Swinnen more than expected).

Fields of papers citing papers by Bart Swinnen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bart Swinnen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bart Swinnen. The network helps show where Bart Swinnen may publish in the future.

Co-authors

The 25 scholars most cited alongside Bart Swinnen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Bart Swinnen Line = papers co-authored together Bart Swinnen links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 121 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	The phenotypic variability of amyotrophic lateral sclerosis Nature Reviews Neurology ·Bart Swinnen, Wim Robberecht Hit paper breakdown →	2014	428
2	3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 &#x003BC;m pitch through-Si vias Bart Swinnen, Wouter Ruythooren, Piet De Moor, Lieve Bogaerts, L. Carbonell, Koen De Munck, B. Eyckens, Serguei Stoukatch, Deniz Sabuncuoglu Tezcan, Zs. Tôkei, Jan Vaes, J. Van Aelst, Eric Beyne	2006	161
3	RNA toxicity in non‐coding repeat expansion disorders The EMBO Journal ·Bart Swinnen, Wim Robberecht, Ludo Van Den Bosch	2019	117
4	A zebrafish model for C9orf72 ALS reveals RNA toxicity as a pathogenic mechanism Acta Neuropathologica ·Bart Swinnen, André Bento‐Abreu, Tania F. Gendron, Steven Boeynaems, Elke Bogaert, Rik Nuyts, Mieke Timmers, Wendy Scheveneels, Nicole Hersmus, Jiou Wang, Sarah Mizielinska, Adrian M. Isaacs, Leonard Petrucelli, Robin Lemmens, Philip Van Damme, Ludo Van Den Bosch, Wim Robberecht	2018	88
5	Impact of 3D design choices on manufacturing cost Dimitrios Velenis, Michele Stucchi, Erik Jan Marinissen, Bart Swinnen, Eric Beyne	2009	83
6	Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads Microelectronics Reliability ·Petar Ratchev, Serguei Stoukatch, Bart Swinnen	2005	80
7	3D System Integration Technologies Eric Beyne, Bart Swinnen	2007	73
8	HDAC6 inhibition restores TDP‐43 pathology and axonal transport defects in human motor neurons with TARDBP mutations The EMBO Journal ·Raheem Fazal, Steven Boeynaems, Ann Swijsen, Mathias De Decker, Laura Fumagalli, Matthieu Moisse, J. Vanneste, Wenting Guo, Ruben Boon, Thomas Vercruysse, Kristel Eggermont, Bart Swinnen, Jimmy Beckers, Donya Pakravan, Tijs Vandoorne, Pieter Vanden Berghe, Catherine M. Verfaillie, Ludo Van Den Bosch, Philip Van Damme	2021	71
9	Styloid and Hyoid Bone Proximity Is a Risk Factor for Cervical Carotid Artery Dissection Stroke ·Dimitri Renard, Souhayla Azakri, Caroline Arquizan, Bart Swinnen, Pierre Labauge, Vincent Thijs	2013	69
10	Through-silicon via and die stacking technologies for microsystems-integration Eric Beyne, Piet De Moor, Wouter Ruythooren, Riet Labie, Anne Jourdain, H.A.C. Tilmans, Deniz Sabuncuoglu Tezcan, Philippe Soussan, Bart Swinnen, R. Cartuyvels	2008	66
11	Extraction of the Appropriate Material Property for Realistic Modeling of Through-Silicon-Vias using μ-Raman Spectroscopy Chukwudi Okoro, Yang Yu, Bart Vandevelde, Bart Swinnen, Dirk Vandepitte, Bert Verlinden, Ingrid De Wolf	2008	64
12	3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding Guruprasad Katti, Ali Merç, J. Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michele Stucchi, Michał Rakowski, I. Debusschere, P. Soussan, Wim Dehaene, K. De Meyer, Youssef Travaly, Eric Beyne, S. Biesemans, Bart Swinnen	2009	56
13	Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications Anne Jourdain, Thibault Buisson, Alain Phommahaxay, A. Redolfi, Sarasvathi Thangaraju, Youssef Travaly, Eric Beyne, Bart Swinnen	2011	52
14	Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture Chukwudi Okoro, Mario González, Bart Vandevelde, Bart Swinnen, Geert Eneman, Serguei Stoukatch, Eric Beyne, Dirk Vandepitte	2007	45
15	3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot Proceedings of the IEEE ·Pierre Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Apostolos Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne	2009	44
16	C9orf72 loss-of-function: a trivial, stand-alone or additive mechanism in C9 ALS/FTD? Acta Neuropathologica ·Elke Braems, Bart Swinnen, Ludo Van Den Bosch	2020	43
17	Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers A. Redolfi, Dimitrios Velenis, Sarasvathi Thangaraju, P. Nolmans, Patrick Jaenen, Maarten Kostermans, Ulrich Baier, Els Van Besien, Harold Dekkers, T. Witters, N. Jourdan, A. Van Ammel, K. Vandersmissen, Simon Rodet, Harold Philipsen, Aleksandar Radisic, N. Heylen, Youssef Travaly, Bart Swinnen, Eric Beyne	2011	43
18	Simultaneous Cu-Cu and Compliant Dielectric Bonding for 3D Stacking of ICs Anne Jourdain, Serguei Stoukatch, Piet De Moor, Wouter Ruythooren, Stefan Pargfrieder, Bart Swinnen, Eric Beyne	2007	43
19	3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias IEEE Transactions on Components Packaging and Manufacturing Technology ·Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen, Fabrice Duval, Patrick Jaenen, Youssef Travaly, Philippe Soussan, Bart Swinnen, Eric Beyne	2011	42
20	Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging Deniz Sabuncuoglu Tezcan, Fabrice Duval, Harold Philipsen, Ole Lühn, Philippe Soussan, Bart Swinnen	2009	41

About Bart Swinnen

Bart Swinnen is a scholar working on Electrical and Electronic Engineering, Neurology, Atomic and Molecular Physics, and Optics, Biomedical Engineering and Cellular and Molecular Neuroscience, having authored 121 papers that have together received 2.6k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (61 papers), Electronic Packaging and Soldering Technologies (36 papers), Neurological disorders and treatments (19 papers), Parkinson's Disease Mechanisms and Treatments (15 papers), Advanced Surface Polishing Techniques (15 papers), Magnetic properties of thin films (14 papers), Additive Manufacturing and 3D Printing Technologies (13 papers) and Semiconductor materials and devices (13 papers). The work is most often cited by research in Neurology (660 citations), Genetics (357 citations), Electrical and Electronic Engineering (1.5k citations), Automotive Engineering (247 citations) and Hardware and Architecture (106 citations). Bart Swinnen has collaborated with scholars based in Belgium, Netherlands and United States. Frequent co-authors include Wim Robberecht, Eric Beyne, Ludo Van Den Bosch, Serguei Stoukatch, Anne Jourdain, Wouter Ruythooren, Deniz Sabuncuoglu Tezcan, Piet De Moor, Bart Vandevelde and Michele Stucchi. Their work appears in journals such as Journal of Magnetism and Magnetic Materials, Movement Disorders, Physical review. B, Condensed matter, Neuromodulation Technology at the Neural Interface and Acta Neuropathologica.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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